TI’s new power-management solutions enable scalable AI infrastructures
What's new
Texas Instruments (TI) debuted new design resources and power-management chips to help companies meet growing artificial intelligence...
ROHM Publishes White Paper on Power Solutions for Next-Generation 800 VDC Architecture
ROHM has released a new white paper detailing advanced power solutions for AI data centers based on the novel 800 VDC architecture,...
Microchip Unveils First 3 nm PCIe Gen 6 Switch to Power Modern AI Infrastructure
As artificial intelligence (AI) workloads and high-performance computing (HPC) applications continue to drive unprecedented demand for faster data movement and lower latency,...
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
800 Volt DC AI Data Centers:
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it...
Power Integrations Details 1250 V and 1700 V PowiGaN Technology for Next-Generation 800 VDC...
Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, outlined the benefits of its PowiGaN gallium-nitride technology for next-generation...
Infineon expands power path protection portfolio for 48 V and future AI data center...
Infineon Technologies AG launched its 48 Volt smart eFuse family and a reference board for hot-swap controllers for 400 V and 800...
STMicroelectronics joins FiRa board, strengthening commitment to UWB ecosystem and automotive Digital Key adoption
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced that Rias Al-Kadi, General Manager of...
Ambiq’s SPOT Platform Named One of TIME’s Best Inventions of 2025
Ambiq Micro, Inc. (NYSE: AMBQ), a technology leader in ultra-low-power semiconductor solutions for edge AI, announced that TIME has listed Ambiq’s Subthreshold Power...
Tobii and STMicroelectronics enter mass production of breakthrough interior sensing technology
Highlights:
Starting mass production of an advanced interior sensing system for a premium European carmaker for enhanced...
YINCAE Launches UF 66L Optical Clear Underfill for High-Reliability Silicon Photonics and Optoelectronic Packaging
YINCAE is proud to announce the release of UF 66L, a next-generation Optical Clear Underfill (OCU) engineered for silicon photonics, optoelectronic packaging,...
