Microchip Expands PolarFire FPGA Smart Embedded Video Ecosystem with New SDI IP Cores and...
Microchip Technology has expanded its PolarFire FPGA smart embedded video ecosystem to support developers who need reliable, low-power, high-bandwidth video connectivity. The embedded vision solution...
LYNRED unveils YOCTO, a new ultra-compact 8µm microbolometer pushing uncooled thermal imaging to a...
LYNRED, a global leader in infrared imaging technologies, announces the launch of YOCTO, a new family of uncooled thermal sensors based on...
CEA-Leti Advances Silicon-Integrated Quantum Cascade Lasers for Mid-Infrared Photonics
Silicon-Integrated Quantum Cascade Lasers:
New Hybrid Laser Architectures Presented at Photonics West Demonstrate
Compound Semiconductor Market Size Worth USD 87.61 Billion by 2034
Market Overview
The compound semiconductor market has demonstrated remarkable resilience and growth potential, with valuations reaching USD 49.29 billion in 2025,...
MosChip Delivers a Custom SoC to ISRO’s Space Applications Centre (SAC) for India’s Satellite...
MosChip Technologies, a leading provider of silicon and product engineering services, announced the successful silicon bring-up of SAC’s custom SoC in 28nm...
u-blox ZED-X20P All-Band High Precision GNSS Module, Now at Mouser
ZED-X20P GNSS module:
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products,...
Leapers Semiconductor Adopts Melexis’ Pioneering Si-RC Snubber
Melexis is pleased to announce that Leapers Semiconductor, a global manufacturer of advanced power semiconductor modules, is incorporating the Melexis MLX91299 silicon-based...
Indium Corporation Experts to Present on Soldering and Sinter Materials at NEPCON Japan 2026
Indium Corporation experts will deliver presentations on soldering processes and sinter material selection at NEPCON Japan 2026. The 40th-anniversary conference, held in Tokyo, Japan, from...
SST and UMC Announce Immediate Availability of 28nm SuperFlash Gen 4 Automotive Grade 1 Platform
28nm SuperFlash Gen 4 Automotive Grade 1 Platform:
As the automotive industry requirements for increasingly performant vehicle controllers relentlessly...
New at Mouser: PAN1783/A Bluetooth 5.4 LE Modules for Advanced Wireless Connectivity with Low...
PAN1783/A Bluetooth 5.4 LE Modules:
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the...
