Tenstorrent Expands Deployment of Arteris’ Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions
Arteris, Inc., a leading provider of system IP which accelerates system-on-chip (SoC) creation, announced Tenstorrent has licensed its network-on-chip (NoC) IP for...
Nexperia and KOSTAL form a strategic partnership based on advancing automotive-grade wide bandgap devices
Nexperia announced that it has entered into a strategic partnership with KOSTAL, a leading automotive supplier, which will enable it to produce...
Power Integrations Launches 1700 V GaN Switcher IC, Setting New Benchmark for Gallium Nitride...
Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, introduced a new member of its InnoMux-2 family of single-stage, independently regulated multi-output...
ULVAC Launches Technology Center PYEONGTAEK for Next-Gen Semiconductor Manufacturing Equipment in South Korea
ULVAC, Inc., the world’s leading comprehensive vacuum manufacturer, has established Technology Center PYEONGTAEK in Pyeongtaek, Gyeonggi-do, South Korea.
The...
Magnachip Expands Production of 7th Generation MXT LV MOSFETs Based on Super Short Channel...
Magnachip Semiconductor Corporation announced the expansion of production for its 7th generation MXT LV MOSFETs, which are based on Magnachip's Super Short...
Infineon unveils the world’s thinnest silicon power wafer, pushing technical boundaries and improving energy...
Highlights:
Infineon first to master handling and processing of ultra-thin 20-micrometer power semiconductor wafers
Renesas Collaborates with Intel on Best-in-Class Power Management Solution for New Intel Core Ultra...
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced a collaboration with Intel resulting in a power management solution that...
Semiconductor Bonding Equipment Market Forecasted to Expand at 10% CAGR, 2024-2032
The global semiconductor bonding equipment market was valued at USD 530.4 million in 2023 and is projected to indicate a CAGR of...
CoolSiC Schottky diode 2000 V enables higher efficiency and design simplification in DC link...
Many industrial applications today are transitioning to higher power levels with minimized power losses, which can be achieved through increased DC link...
STMicroelectronics reveals Page EEPROM two-in-one memory to boost smart-edge performance and efficiency
STMicroelectronics' Page EEPROM combines the power efficiency and durability of an EEPROM with the capacity and speed of a Flash memory, creating...
