Indium Corporation to Feature Hybrid Metal Thermal Interface Materials

at Semi-Therm Workshop

Indium Corporation will feature its unique solid/liquid hybrid thermal interface materials—m2TIMTM—at the Semi-Therm Thermal Technologies Workshop, Nov. 4-6, Redmond, Wash.

Indium Corporation’s m2TIM combines liquid metal with a solid metal preform to provide reliable thermal conductivity for heat dissipation without the need for a solderable surface. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity.

Other m2TIM benefits include:

  • Availability in a variety of alloys, including InGa and InGaSn
  • Extraordinary wetting ability to both metallic and non-metallic surfaces
  • Extremely low interfacial resistance at surfaces
  • Eliminated risk of pump-out of the liquid alloy due to absorption by solid solder preforms

For more information about Indium Corporation’s full line of thermal interface materials (TIMs), visit www.indium.com/TIM.