Indium Corporation will feature its suite of ultra-low residue flip-chip fluxes for enabling the 5G lifestyle at the 18th China Semiconductor Packaging and Test Seminar (CSPT), November 8-10, TianShui City, China.
Indium Corporation has developed a suite of leading-edge materials and technology expertise to meet the demanding performance improvement of mobile communications that enable the dynamic 5G lifestyle.
Indium Corporation’s ultra-low and near-zero residue, no-clean flip-chip fluxes eliminate the cost of cleaning flux residues, improving package reliability by preventing damage to the die from stresses during cleanings. The simplified assembly process can also help reduce total packaging costs.
Indium Corporation’s ultra-low and near-zero residue, no-clean flip-chip fluxes provide enhanced activity control that avoids the two main soldering issues: solder bridging and cold joints. This flux technology also retains bump height after reflow, reduces the UBM/bump crack damage in the cleaning process, and boasts a high compatibility with capillary and molded underfills (CUF and MUF).
The suite of fluxes, from the lowest flux residue NC-699 (less than 2%) to NC-26-A (around 5%) and NC-26S (less than 10%), are suitable to be used on a wide range of flip-chip die-attach applications, from typical C4 solder bump to micro Cu pillar bump, from flip-chip on leadframe to flip-chip on wafer/substrate applications.