
As one of the leading materials providers in the electronics assembly industry, Indium Corporation is looking forward to featuring its innovative Durafuse solder technology at NEPCON Japan, taking place January 22-24, in Tokyo, Japan.
Indium Corporation will showcase the following among its featured products:
- Durafuse LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, lowtemperature, and step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock and thermal cycling performance, and even outperforms SAC305 with optimal process setup.
- Durafuse HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Durafuse HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
To learn more about Indium Corporation’s solder solutions, visit www.indium.com or visit our experts at NEPCON Japan at booth E66-22.