Indium Corporation Experts to Deliver Technical Presentations at SMTA International

As one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.

October 20
4:30 p.m.
A Bi-Free In-Containing Lower Temperature Solder with Superior Drop Shock Resistance and Electromigration Resistance, presented by Associate Scientist Mengyao Wen, authored by Dr. Hongwen Zhang, Danyang Zeng, and Huaguang Wang

October 21
9:00 a.m.
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly With Lower Temperature Soldering Phase I: Processing Optimization, presented by Associate Scientist Cassandra Goppert, authored by Dr. Hongwen Zhang, Dr. Francis Mutuku, and Huaguang Wang

11:00 a.m.
Mitigating Solder Joint Defects Caused by the Warpage of BGA Assembly With Lower Temperature Soldering Phase II: TCT Reliability, presented by R&D Manager, Alloy Group, Principal Metallurgist Dr. Hongwen Zhang, co-authored by Danyang Zeng, Huaguang Wang, and Dr. Francis Mutuku

2:00 p.m.
Effect of Copper Content on Interfacial Reaction of In-Containing Lead-Free Solder Joints Across Different Surface Finishes, presented by Research Metallurgist Huaguang Wang

4:30 p.m.
Supercooled Solder Pastes for Low-Temperature Electronics Manufacturing, presented by Associate Scientist I Radhika Jadhav, co-authored by Dr. Yifan Wu and Dr. Ian Tevis

October 22
2:00 p.m.
A Novel Flux-Less Solder Paste Reflowed Under Formic Acid for Surface Mounting Technology, presented by R&D Assistant Manager Lily Bai

2:30 p.m.
Application of New Ultra-Low Residue Solder Paste for System-in-Package, presented by Senior Area Technical Manager, East China, Leo Hu Yan Jie, co-authored by Jonas Sigfrid Sjoberg, Xinfang Liu, Jinjin Bai, and Fiona Chen

3:00 p.m.
Influence of Reflow Temperature on the Mechanical Strength of Lower-Temperature Solder Pastes Across Various Surface Finishes, presented by Research Chemist-Metallurgist Dangyang Zheng, co-authored by Liam Evans, Cassandra Goppert, Mengyao Wen, Dr. Huaguang Wang, Dr. Francis Mutuku, and Dr. Hongwen Zhang

5:30 p.m.
Void Mitigation for Exposed Pad of D2PAK Component, presented by Associate Director for Global Technical Services and Application Engineering Jonas Sjoberg, authored by Tushar Tike

6:00 p.m.
Optimizing Mixed Alloy Solder Pastes for Low Voiding and High PCB Reliability, presented by Technical Support Engineer II Thuy Nguyen, co-authored by Dr. Hongwen Zhang, Dr. Ronald C. Lasky, and Adam Murling

October 23

9:00 a.m.
Tin Whiskers 101: 2025,
 presented by Senior Technologist Dr. Ron Lasky

The full agenda is available on the SMTAI website. To learn more about Indium Corporation’s high-reliability solutions, visit the company’s experts at SMTAI in booth 2842.

For more information about Indium Corporation, visit www.indium.com.