New QSMP-23 module offers cost-optimised STM32 MPU platform to boost machine learning edge computing

QFN-style 27mm² SoM features dual ARM Cortex-A35, NPU, VPU & GPU to combine ML edge processing with powerful multimedia capabilities

Direct Insight, the UK-based technical systems integrator focused on system-on-module (SoM) solutions, can now deliver and support development for cost-optimised ML edge computing applications with QSMP-23 solder-down QFN-style SoMs (system-on-modules), featuring second-generation STMicro STM32MP2 MPUs.

“This new QSMP-23 solder-down module delivers a cost-optimised industrial-grade 64-bit solution for secure Industry 4.0 and machine learning edge computing applications that require powerful multimedia capabilities,” commented David Pashley, co-founder & Managing Director at Direct Insight. “Incorporating high performance connectivity, multimedia and display with a Yocto-build mainline Linux BSP, this SoM simplifies design and production, with its QFN (quad flat no-lead) solder-down package optimising size and price, while simplifying PCB layout and EMI (electromagnetic interference) compliance.”

Manufactured by Direct Insight’s long-standing partner, Ka-Ro Electronics, the new QSMP-23 is a 27mm x 27mm QFN-style solder-down system-on-module featuring STMicroelectronics’ STM32MP235 microprocessor. Dual ARM Cortex-A35 processors, clocked at 1.2GHz, are complemented by a 400MHz ARM Cortex-M33 MCU (microcontroller), a 0.6 TOPS NPU (neural processing unit) for AI/ML (artificial intelligence/machine learning) tasks, dual MIPI-CSI camera inputs and a powerful GPU (graphics processing unit), as well as an HD 60fps video pipeline.

The QSMP-23 module adds 1GB LPDDR4 RAM, 4GB eMMC and power management, integrated on a tiny footprint QFN package for excellent EMC (electromagnetic compatibility), thermal and cost optimisations. The module is square, with a height of 2.6mm, and requires a single 3.3v supply. A full industrial operating temperature range of -40°C to +85°C is supported.

A wide range of interfaces is supported, including dual USB 2.0 (with on-module PHYs) and dual Gigabit Ethernet. Other connectivity includes 3x UART, 3x I2C, 2x SPI, PWM, SAI and 2x CAN. Advanced security features support IoT (internet of things) and industrial applications, ready for a CRA-compliant system implementation. The QSMP-23 comes with a dedicated Yocto Scarthgap build, providing a mainline Linux kernel, with full sources and toolchain supplied, as well as extensive documentation.

Learn more, download the datasheet, and order modules or development kits at: directinsight.co.uk/ka-ro-qsmp-23-solder-down-module-with-dual-core-stm32mp235/