Hyundai Mobis Qualcomm SDV agreement:
- MOU signed at CES 2026 to co-develop integrated solutions for automotive tailored to emerging markets.
- Hyundai Mobis to enhance performance, efficiency, and stability for advanced driver assistance systems using the Snapdragon Ride Flex system-on-chip.
- Companies’ agreement extends beyond ADAS development, with plans to deliver broader SDV solutions based on Snapdragon automotive technologies.
Hyundai Mobis and Qualcomm Technologies, Inc. announced that the companies have signed a comprehensive agreement at CES 2026 to co-develop next generation solutions for Software-Defined Vehicle (SDV) and Advanced Driver Assistance Systems (ADAS). The MOU signing, held at the Hyundai Mobis booth, was attended by Jung Soo-Kyung, Executive Vice President and head of Automotive Electronics Business Unit, and Mr. Nakul Duggal, EVP and Group GM, Automotive, Industrial and Embedded IoT and Robotics, Qualcomm Technologies, Inc.
Through this collaboration, Hyundai Mobis and Qualcomm Technologies will jointly develop integrated solutions tailored for emerging markets while pursuing broader global supply opportunities by leveraging the combination of Hyundai Mobis’s expertise in system integration, sensor fusion, and perception with Qualcomm Technologies’ leadership in system‑on‑chip (SoC) technology.
The companies will begin their work with their co‑development of advanced driving and parking solutions based on the Snapdragon Ride Flex system-on-chip (SoC). These innovations will target fast‑growing markets such as India, where ADAS adoption is expanding across vehicle segments alongside rising demand for SDV‑ready architectures. For future SDV applications, they will also work together on next‑generation integrated solutions that combine Hyundai Mobis’s standardized software platform with Qualcomm Technologies’ Snapdragon automotive technologies to enhance performance, efficiency, and stability.
For more information, visit Hyundai Mobis and Qualcomm Technologies website.
