Indium Corporation will feature its formic acid soldering technologies (FAST) product series at NEPCON Japan 2026, taking place January 21-23, in Tokyo.
The company will feature various solutions ideal for power device packaging, ranging from pastes, solders, and tracking agents.
- InFORMS are reinforced solder preforms that improve mechanical strength and produce consistent bondline thickness for superior reliability performance compared to traditional solder preforms, particularly in power module applications.
- Indalloy 301LT for Preforms/InFORMS is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
- AuLTRA ThInFORMS are 0.00035-inch-thick (0.00889mm, or 8.89μm) 80Au/20Sn preforms that improve the overall operational efficiency of high-output lasers. AuLTRA ThInFORMS help combat common issues such as shorting and poor thermal transfer.
Learn more about FAST solutions at the Indium Corporation website and visit our experts at NEPCON Japan 2026, booth #E1-36.
