Indium Solder Thermal Interface Materials – Indium Corporation® Applications Development Engineer, Engineered Solder Materials (ESM), Kyle Aserian, will present research on the use of indium-based solder thermal interface materials (sTIMs) to address next-generation AI and high-performance computing thermal challenges at the IEEE Electronic Components and Technology Conference (ECTC), May 26-29, in Orlando, Florida.
The presentation, Fluxless Vacuum Formic Acid Reflow of Indium Solder Thermal Interface Materials in Large Area BGA Packages, reveals that indium sTIMs, with 86W/mK thermal conductivity, significantly outperform polymer thermal interface materials (TIMs) through enhanced metallurgical bond capability, and improved thermal cycling performance and reliability. Additionally, vacuum formic acid reflow minimizes voiding—critical for multi-reflow applications like BGA assembly. Research results demonstrate pathways to ultra-low voiding for uniform heat dissipation in demanding next-generation processors and data center applications.
Kyle Aserian is an Applications Development Engineer in the ESM department, specializing in high-performance TIMs and their successful implementation into real-world assemblies. He joined Indium Corporation in 2022 as a Research Associate Scientist, focusing on solder alloy characterization and test method development.
ECTC attendees can attend Aserian’s presentation on May 27 at 11:55 a.m. EDT.
For more information visit: indium.com
