Semiconductor company KD proudly announced a distribution agreement with Hitachi High-Tech Corporation (“Hitachi High-Tech”). Under the agreement, Hitachi High-Tech will support market access and customer engagement for KD’s integrated optoelectronic devices in Japan, making it easier for automotive Tier-1s and suppliers to evaluate and adopt optical multigigabit connectivity solutions for next-generation vehicle architectures.
Takahiro Sugihara, Head of Industrial & Social Infrastructure Business from THE, commented on the agreement: “KD is a pioneer in high-speed in-vehicle networking. This agreement aligns well with our commitment to providing cutting-edge technologies, products, and services that support the evolution of automotive electronics and advanced mobility, in line with our corporate vision of ‘Changing the World and Future with the Power of Knowledge.’”
Óscar Ciordia, Marketing and Sales Director of KD, emphasized the strategic importance of the cooperation: “Japan is a highly advanced automotive market with strong technology leadership across OEMs and Tier-1 suppliers. We are honored to collaborate with Hitachi High-Tech as a business partner to better serve this market. This agreement represents an important milestone and a clear signal that optical multigigabit in-vehicle connectivity is gaining momentum in Japan. The collaboration is expected to accelerate adoption of optical networking across the Japanese automotive ecosystem.”
Focus on KD7251: Integrated Optoelectronics for Automotive Networks
As part of the collaboration, Hitachi High-Tech will support the introduction of KD’s KD7251, an integrated optoelectronics device designed for high-speed in-vehicle data transmission. Targeting demanding automotive environments, the device supports the transition toward scalable, future-proof network platforms for ADAS, infotainment, and emerging software-defined vehicle architectures.
The KD7251 combines optical and electronic functionality in a single device, enabling robust multigigabit links while helping automotive system designers address bandwidth growth, electromagnetic interference (EMI) constraints, and packaging efficiency in zonal and centralized vehicle architectures. The ASIC implements the BASE-AU physical layers and is compliant with the IEEE Std 802.3cz specification for automotive multigigabit optical communications links over multi-mode glass optical fiber (OM3).
Designed as a single-chip solution with an on-chip optical interface, the KD7251 supports data rates of 2.5, 5, and 10 Gb/s. It also includes bridging functionality to enable direct connectivity of MIPI-based sensors such as cameras and radar (CSI-2), displays (DSI-2℠), as well as AI processors via PCIe, simplifying system integration within the vehicle.
