Copper Sinter Solutions:
Indium Corporation Product Manager – Semiconductor Dean Payne will present copper sinter paste solutions that deliver high thermal and reliability performance, while addressing power electronics cost pressures at APEC 2026, March 22-26, in San Antonio, Texas.
The presentation, Sinter Pastes for Industry Standard and State-of-the-Art Power Electronics Assembly, will demonstrate that as cost-reduction demands increase across the industry, copper sinter pastes offer thermal and electrical performance comparable to silver at a lower expense. Case study solutions discussed include pressureless copper sinter for discrete SiC TO-247 packages and pressure-assisted pastes for SiC die-attach on ceramic substrates, and large-area heat-sink attachment in advanced high-power electronics applications.
Dean Payne is responsible for driving profitable growth of Indium Corporation’s power semiconductor materials, which include high-Pb die-attach paste, high-temperature Pb-free solutions, and sintering materials. Payne collaborates with internal departments, including sales, technical service, R&D, production, and quality, providing support for all semiconductor and advanced assembly materials.
APEC 2026 visitors can attend Payne’s presentation on Wednesday, March 25, at 12:00 p.m. CST. To learn more about Indium Corporation’s power electronics and solder solutions, visit indium.com or meet with our experts at APEC booth #1553.
For more information, visit www.indium.com.
