ViTrox Semiconductor Inspection Systems – ViTrox, which aims to be the World’s Most Trusted Technology Company in providing innovative, advanced, and cost-effective automated Machine Vision Inspection Solutions for the semiconductor and electronics packaging industries, is pleased to announce its participation in SEMICON Southeast Asia 2026. The exhibition will be held from 5 to 7 May 2026 at the Malaysia International Trade and Exhibition Centre (MITEC), Kuala Lumpur, at Level 1 Hall 3, Booth #1410.
Advanced Wafer & Die Inspection
ViTrox is pushing the boundaries of sub-micron precision with dedicated solutions for the earliest stages of semiconductor manufacturing:
- WiX Ai Smart Wafer Inspection Machine: This unified platform leverages AI Inspection Intelligence to detect sub-micron defects (< 1 µm), preventing yield loss before packaging. It features autonomous material handling and Smart Factory readiness to support fully connected, high-throughput production.
- PX40Ai Die Sorting, Inspection & Package Solution: Engineered for high-speed performance, this system handles die sorting, six-sided inspection, and tape-and-reel packaging, offering a high-efficiency alternative to manual inspection.
Advanced Integrated Vision Systems
In addition to standalone handlers, ViTrox provides specialised vision modules for seamless line integration:
- 2.5D Inpocket Vision System: A compact module designed for existing lines, utilising hybrid lighting to inspect for microcracks and surface defects within carrier tapes.
- Lead Frame Vision System: An AI-integrated platform using Deep Learning and SWIR (Short-Wave Infrared) to manage complex defect detection and OCR traceability with unprecedented precision.
Precision Performance for Next-Gen Manufacturing
ViTrox is set to showcase a comprehensive lineup of inspection systems designed to master the complexities of modern semiconductor environments:
- TH3000i Smart Tray Based Vision Handler (AI): A high-mix 2D and 3D inspection system for marking, surface, pad, leaded and BGA inspection with ±5um accuracy. Supporting JEDEC and thick tray loading with auto-singulation, this platform is enhanced by AI Inspection Intelligence to deliver advanced defect classification and 6-sided inspection performance for future-ready advanced packaging requirements.
- LC20Ai-T Smart Universal Vision Handler: Designed for high-mix production environments, this system combines advanced vision capabilities with intelligent automation to ensure accurate handling and inspection. With stable unit positioning and efficient material flow, the LC20Ai-T supports manufacturers in achieving high-quality standards while maintaining productivity.
- VR20Ai G2 Post Seal Vision Handler: A high-speed, dual-track system that replaces manual inspection. This solution features automated tape insertion and width conversion (8 to 32 mm), combining AI-driven technology with flexible operation to ensure reliable results. Equipped with the TriSight lifted lead inspection system and SWIR capability, it ensures accurate detection of both surface and inner defects.
- V510Ai Vision Pro Smart 3D AOI for Substrate-Level & SiP Inspection: Combines high-resolution 3D inspection with a hybrid visible 25MP vision system and SWIR imaging to detect SMT passive component defects, inner die cracks, and critical surface anomalies beyond the capability of conventional AOI systems. Powered by AI-driven defect classification, it improves detection consistency and yield stability in complex and high-density SiP modules.
SMT PCB Assembly Production Line
ViTrox will also showcase its SMT PCB Assembly Vision Inspection ecosystem through immersive 3D models. This display illustrates a complete, intelligent production line designed to enhance yield and ensure total quality assurance. Visitors can explore the seamless integration of Smart 3D SPI, Smart 3D AOI, and Smart 3D X-ray Inspection (AXI). The lineup is completed by the Smart Robotic Optical System (ARV) for Conformal Coating and Final Inspection, demonstrating ViTrox’s commitment to advanced, high-capacity electronics manufacturing.
Expert Insights: Revolutionising Advanced Packaging
The event will also feature a technical session by Mr. Oon Min Shen, Global Business Development – S.E.A., titled “Revolutionising Advanced Packaging with Vision AI Inspection.” His presentation will dive deep into how AI-driven inspection is transforming next-generation packaging, specifically focusing on CoWoS lid inspection and complex stacked package measurements. He will also discuss the strategic use of Short-Wave Infrared (SWIR) technology to detect hidden defects, showcasing how AI defect classification significantly improves detection sensitivity.
Empowering the Next Generation
ViTrox is dedicated to nurturing future talent through its People Management (PM) and ViTrox Academy (VA) teams. Representatives will be available at our booth to discuss career and academic opportunities, while attendees are also encouraged to visit the NextGen Hub (Hall 1, Booth #W1858) to discover how ViTrox is actively shaping the future of the technology workforce.
For more information visit: www.vitrox.com
