Automated Production of Loudspeakers and Headphones
According to statistics, the proportion of connected cars in the USA will be around 97% in 2035; the figure could be similar...
Solid State relays from Sensata Crydom for high density PCB applications now available through...
Now in stock in Europe at TTI, Inc., a world leading specialist distributor of electronic components, are CX Series SIP Solid State relays from...
u-blox Provides Concurrent GNSS Technology to Timing Synchronization System
u‑blox, a global leader in wireless and positioning modules and chips, announced that its LEA‑M8T concurrent GNSS timing module is now being used by V3Novus, a provider...
GES introduces small IP68 multi-pin high voltage connectors
GES High Voltage, Inc. – a leader in high voltage connectivity – introduces Series MCS, small IP68 multi-pin high voltage connectors. These significantly downsized and easy to...
New 3D short pulse fiber laser marker LP-ZV by Panasonic Industry
Panasonic Industry is proud to introduce the latest innovation in laser marking technology: The LP-ZV series offers high speed and precision in...
Pasternack Debuts Quick Connect Attenuators with QMA, QN and 4.3-10 Connectorized Designs
Pasternack, a leading provider of RF, microwave and millimeter wave products, has released a new line of attenuators for quick mating and easy installation. Typical...
New Thermal Gap Fillers provide effective heat transfer for multiple applications
Electrolube has launched a new range of thermal gap fillers that provide a highly effective heat transfer solution for many different applications.The...
2.3Mp CMOS Digital Image Sensor with BSI Pixel Technology to Satisfy Challenging Security and...
ON Semiconductor, driving energy efficient innovations, has introduced a new 1/2.7-inch 2.3 Megapixel (Mp) CMOS digital image sensor with an active-pixel array of 1936H...
Infineon’s new CoolSiC MOSFETs 2000 V offer increased power density without compromising system reliability
Infineon Technologies AG introduces the new CoolSiC MOSFETs 2000 V in the TO-247PLUS-4-HCC package to meet designers' demand for increased power density...
Effortless Integration: RECOM Products Now Available in EPLAN
RECOM EPLAN integration
RECOM is excited to announce a strategic cooperation with EPLAN, a leading provider of CAE (Computer-Aided...
