Vishay Introduces Gen 3 1200V SiC Schottky Diodes Increase Efficiency and Reliability for Switching...
Vishay Intertechnology, Inc. introduced 16 new Gen 3 1200 V silicon carbide (SiC) Schottky diodes. Featuring a merged PIN Schottky (MPS) design, the...
ST4SIM-300: Industry-first embedded SIM from STMicroelectronics supports new standard expected to revolutionize bulk IoT...
STMicroelectronics has introduced the ST4SIM-300, the first embedded SIM in the industry to meet the incoming GSMA standard for eSIM IoT deployment. Also known...
Pickering Interfaces Expands Upon the Industry’s Largest Portfolio of PXI Digital I/O Modules
Pickering Interfaces, the leading provider of modular signal switching and simulation products for electronic test and verification, has announced four new industrial digital...
Basler Presents CoaXPress 2.0 Camera in a Small Design
The Basler ace 2 V expands the portfolio of the well-known ace 2 camera series with single-channel CoaXPress 2.0 cameras in a...
Infineon expands AIROC Wi-Fi 6/6E with CYW5591x microcontrollers
Infineon Technologies AG announced the company’s new AIROC CYW5591x Connected Microcontroller (MCU) product family. The new family integrates robust, long-range Wi-Fi 6/6E...
element14 adds new connectivity, power and housing stock from Phoenix Contac
element14 has announced that it has added stock of new, industry-leading products from Phoenix Contact, some of which feature Push-X technology which enables...
Infineon Extends Radiation-Hardened Memory Portfolio with 1 and 2 Mb F-RAMs
Space-based applications are an important area for Infineon Technologies AG, with the company’s products being used in satellites, mars rover instruments and...
AAEON Introduces 13th Gen Intel Core Processing to the COM Express Type 10 Form...
AAEON, a leading provider of Computer-on-Modules, has announced the NanoCOM-RAP, a COM Express Type 10 CPU Module powered by 13th Generation Intel...
Indium Corporation Introduces Cutting-Edge,High-Reliability Alloy for Solder Paste
Indium Corporation is proud to introduce Durafuse HR, a new high-reliability alloy used for solder paste, developed from the company's Durafuse mixed-alloy technology. Durafuse HR is a patent-pending alloy...
e-con Systems Unveils new Robust All-Weather Global Shutter Ethernet Camera for Outdoor Applications
e-con Systems, a global leader in embedded vision solutions, introduces a new Outdoor-Ready Global Shutter GigE camera —RouteCAM_CU25, the powerful addition to...
