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Embedded & Software

MCU market revenue

Microcontroller market growth drops to nearly zero in 2019

Microcontroller market growth drops to nearly zero in 2019 as industry and geopolitical factors dampen demand Following two years of expansion, the global microcontroller (MCU)...
Smart, Connected Devices

STMicroelectronics collaborate with Microsoft: STM32 developers can now access Microsoft Azure RTOS

Integration lets STM32 developers access Microsoft Azure RTOS (Real-Time Operating System) for embedded projectsSecurity- and safety-certified RTOS is free to use and...
Clock Drivers

Renesas Clock Drivers for DDR5 DRAM Servers & Client Systems

Renesas Electronics Corporation introduced the third generation DDR5 registered clock drivers (RCD) as well as the first-generation client clock driver (CKD) for...
COMPUTEX 2023

AAEON to showcase upcoming Product Demonstrations during COMPUTEX 2023

With COMPUTEX 2023 taking place from May 30th to June 2nd, 2023 at the Taipei Nangang Exhibition Center, AAEON will showcase both...
COM Express Type 10

COM Express Type 10 Powered by 11th Gen Intel Core Processor Family by AAEON

To optimize embedded and mobile applications for today's IoT requirements, AAEON, a leading manufacturer of advanced hardware platforms for SDN, NFV, SD-WAN...
Embedded AI

Advanced Embedded AI & TinyML on General Purpose MCUs & MPUs with Reality AI...

Renesas Electronics Corporation provided an update on its progress in providing artificial intelligence (AI) and tiny machine learning (TinyML) solutions one year...
industrial edge solutions

The software module edgeConnector Siemens v1.20 version released

Softing Industrial releases version v1.20 of edgeConnector Siemens. The software module is based on container technology and connects Siemens controllers with industrial...
fanless embedded box PC

Fanless Box PC for Industrial Computing

AAEON announces the BOXER-6641, their latest fanless box PC, featuring 8th Generation Intel Core and Xeon processors. The BOXER-6641 is the most powerful...
Generative AI Applications

Molex Unveils Chip-to-Chip 224G Product Portfolio for Next-Gen Data Centers & Generative AI Applications

Molex has introduced the industry’s first chip-to-chip 224G product portfolio, encompassing next-gen cables, backplanes, board-to-board connectors and near-ASIC connector-to-cable solutions operating at...

Renesas Electronics’ Enhanced RX65N Wi-Fi Connectivity Cloud Kit

Renesas Electronics today announced the Renesas RX65N Cloud Kit featuring onboard Wi-Fi, environmental, light and inertial sensors, and support for Amazon FreeRTOS...

Interview