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Here is your latest news and updates from leading electronics component manufacturer and service provider.

Plural ADCs

Silanna signs distribution agreement with DigiKey for cutting edge 10- to 16-bit Plural ADCs

Silanna Semiconductor, a global leader in analog innovation, has signed a deal with the global electronics distributor, DigiKey. Under...
Rohde & Schwarz

Rohde & Schwarz joins the Ingolstadt Urban Air Mobility initiative as a new partner

As part of the Ingolstadt Urban Air Mobility (UAM) initiative, the technology group will help design future urban mobility. Ingolstadt is an EU model...
800GE Firewall Test

China Mobile to Complete First 800GE Firewall Test with Ixia, a Keysight Business

China Mobile to Complete First 800GE Firewall Test with Ixia, a Keysight Business Keysight Technologies announced that China Mobile completed the industry's first 800 Gigabit Ethernet...
Bulgin MATE_ROV_competition_sponsorship_

Bulgin sponsors MATE International ROV competition

Rugged connector and component manufacturer Bulgin has announced its involvement in the 18th annual MATE (Marine Advanced Technology Education) International ROV competition taking place this...
ON Semiconductor

ON Semiconductor Sponsors IEEE Empower a Billion Lives Competition

ON Semiconductor energy-efficient innovations, announced a sponsorship to IEEE Empower a Billion Lives (EBL), an interdisciplinary, biennial global competition to identify and promote...
Mr. Ramanathan S, CFO - EEMEA, CIS & SAARC Countries

AAF Announces Promotion of Ramanathan to CFO – EEMEA, CIS & SAARC countries

AAF (American Air Filter) announced the promotion of Mr. Ramanathan S from Finance Head- India to Regional CFO (Chief Financial Officer) effective...
USB Type-C Products

Mouser’s New USB Type-C Solution Page

Mouser Electronics is pleased to offer customers a new page dedicated to the comprehensive selection of USB Type-C products from ON Semiconductor and TE Connectivity. USB Type-C...
multi-access edge computing

Altran & Ori Industries Partner to Promote Federated Multi-Access Edge Computing

Altran and Ori Industries are collaborating on a developer-centric initiative to help promote federated multi-access edge computing. Altran and...
packaging technology

KONNEKT packaging technology in KEMET’s KC-LINK range

KEMET Corporation extending its KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors,...
Indian smart devices ecosystem

MediaTek Empowers Indian smart devices ecosystem & 5G capabilities with Focus on R&D

MediaTek reiterated its focus on R&D to enable ‘Make in India’ and ‘AtmaNirbhar Bharat’, during the first Virtual Chapter of the MediaTek...

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