STMicroelectronics extends agreement with Anglia to deliver full support services to customers in the...
STMicroelectronics-Anglia distribution agreement:
Anglia Components is excited to announce that it has entered into an enhanced franchise agreement with STMicroelectronics,...
ST Foundation Global: Empowering Communities Worldwide Through Digital Inclusion
STMicroelectronics organized a press briefing in India to showcase the work of the ST Foundation. The event was not merely a corporate...
Rohde & Schwarz joins the Ingolstadt Urban Air Mobility initiative as a new partner
As part of the Ingolstadt Urban Air Mobility (UAM) initiative, the technology group will help design future urban mobility. Ingolstadt is an EU model...
China Mobile to Complete First 800GE Firewall Test with Ixia, a Keysight Business
China Mobile to Complete First 800GE Firewall Test with Ixia, a Keysight Business
Keysight Technologies announced that China Mobile completed the industry's first 800 Gigabit Ethernet...
Bulgin sponsors MATE International ROV competition
Rugged connector and component manufacturer Bulgin has announced its involvement in the 18th annual MATE (Marine Advanced Technology Education) International ROV competition taking place this...
ON Semiconductor Sponsors IEEE Empower a Billion Lives Competition
ON Semiconductor energy-efficient innovations, announced a sponsorship to IEEE Empower a Billion Lives (EBL), an interdisciplinary, biennial global competition to identify and promote...
AAF Announces Promotion of Ramanathan to CFO – EEMEA, CIS & SAARC countries
AAF (American Air Filter) announced the promotion of Mr. Ramanathan S from Finance Head- India to Regional CFO (Chief Financial Officer) effective...
Mouser’s New USB Type-C Solution Page
Mouser Electronics is pleased to offer customers a new page dedicated to the comprehensive selection of USB Type-C products from ON Semiconductor and TE Connectivity. USB Type-C...
Altran & Ori Industries Partner to Promote Federated Multi-Access Edge Computing
Altran and Ori Industries are collaborating on a developer-centric initiative to help promote federated multi-access edge computing.
Altran and...
KONNEKT packaging technology in KEMET’s KC-LINK range
KEMET Corporation extending its KC-LINK range using KONNEKT high-density packaging technology to meet the growing demand for fast-switching wide bandgap (WBG) semiconductors,...
