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Keysight, NTT, and NTT Innovative Devices Achieve 280 Gbps World Record Data Rate with Sub-Terahertz for 6G

6G Vector Component Analysis
Highlights: Achieved 280 Gbps in the 300 GHz band, surpassing the previous milestone of 240 Gbps, and accelerating the characterization of 6G sub-THz components Breakthrough was achieved with Keysight's Vector Component Analyzer and NTT's and NTT Innovative Devices' InP-based J-band power amplifier with digital predistortion Advanced digital predistortion technology enables high-fidelity...

Mouser Electronics Gears Up for the 6th Edition of India IoT Technical Roadshow

Mouser Technical Roadshow 2025
Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is excited to announce the launch the 6th edition of its India IoT Technical Roadshow across India. The 2025 edition of this eagerly anticipated event series will begin in Pune on June 20, followed by Ahmedabad on...

Rosenberger RoProxCon System-on-Module, Now at Mouser Electronics, Enables Contactless Motor Control

RoProxCon SoM
RoProxCon SoM: Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the RoProxCon system-on-module (SoM) from Rosenberger. The Rosenberger RoProxCon SoM is a radio module designed for high-speed data transmission based on a 60GHz carrier frequency rating. This SoM offers 14.2...

Applied Materials and CEA-Leti Expand Joint Lab To Drive Innovation in Specialty Chips

Applied Materials and CEA-Leti Joint Lab
Applied Materials and CEA-Leti Joint Lab: Applied Materials, Inc. and CEA-Leti announced the next phase of their longstanding collaboration to accelerate innovation in specialty semiconductors. Through an expansion of their joint lab, the organizations plan to develop materials engineering solutions to address emerging infrastructure challenges in AI data centers. The joint lab...

Innatera unveils Pulsar: The world’s first mass-market neuromorphic microcontroller for the sensor edge

Pulsar
Pulsar: First Mass-Market Neuromorphic Microcontroller: Innatera, a leading developer of neuromorphic processors, announced the launch of Pulsar, its first commercially available microcontroller to bring brain-like intelligence into edge devices. Born from more than a decade of pioneering research, Pulsar delivers up to 100X lower latency and 500X lower energy consumption than conventional AI...

AAEON Release World’s First 8L Dual-GPU AI Inference Server, the MAXER-5100

MAXER-5100
Leading provider of advanced AI solutions AAEON, has released a new addition to its AI Inference Server product line, the MAXER-5100 – the world’s first 8L AI inference server equipped with two integrated GPUs.  The MAXER-5100’s default model comes with the 24 core, 32 thread 14th Generation Intel Core i9 processor 14900Kand two onboard...

Mouser Electronics Showcases Latest Sensor Technologies from Leading Manufacturers at Sensors Converge 2025

Sensors Converge 2025
Sensors Converge 2025: Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, will feature cutting-edge sensor technologies from leading manufacturers at Sensors Converge 2025, taking place June 24–26 at the Santa Clara Convention Center, Santa Clara, California. Currently celebrating its 40th year, Sensors Converge has evolved...

Digital Substation Market Size Worth USD 16.53 Billion by 2034 | CAGR: 7.6%

Digital Substation Market
Digital substations are transforming power infrastructure, driven by the need for smarter, more efficient, and resilient energy systems. As utilities upgrade their grids to handle rising demand, integrate renewables, and improve visibility, digital substations are key to this shift. With advanced automation, real-time data, and a smaller footprint, they're changing how power is delivered and managed worldwide.

Synopsys Accelerates AI and Multi-Die Design Innovation on Advanced Samsung Foundry Processes

AI and Multi-Die Design Innovation
AI and Multi-Die Design Innovation: Successful customer tape out of HBM3 design on SF2 process and I-CubeS technology leveraged Synopsys 3DIC Compiler to reduce turnaround time by 10X New Synopsys certified AI-driven digital and analog flows on SF2P accelerate development of high-performance designs AI-driven design technology co-optimization...

Experts from 15 countries discuss future of artificial intelligence at AI Journey’s regional session

AI Journey 2025
AI Journey 2025 Ahead of the St. Petersburg International Economic Forum (SPIEF), top experts spoke about current AI trends during the AI Journey regional track. The conference and a foresight session with researchers from Russia, China, India, Serbia, Brazil, Azerbaijan, South Africa, Cuba, Chile, Belarus, and other countries took place at Sber's TechHub...

Interview