Electronicsmedia

Centralized SDV Architecture with S32E2: Rimac Technology is the first to deploy NXP’s S32E2 real-time processor series in its upcoming next-generation ECU platform for software-defined vehicles (SDV) NXP and Rimac’s jointly developed centralized architecture consolidates more than 20 electronic control units into just three centralized units

Morse Micro, the world's leading provider of Wi-Fi HaLow chips, announces a partnership with Heltec Automation to accelerate the delivery of Wi-Fi HaLow enabled devices. Heltec Automation has integrated Morse Micro's MM6108 Wi‑Fi HaLow SoC into a suite of five highly differentiated products enabling new long-range connectivity, high data speeds, and energy-efficient performance for industrial and commercial IoT.

Semi-Kinetics, a leading provider of electronic manufacturing services, is proud to announce it has won the Emerging Growth Award at the 30th Annual ACG Orange County Awards, held May 29, 2025 at the Irvine Marriott. Selected from more than 100 nominated companies, Semi-Kinetics stood out in the Emerging Growth category, which honors middle-market businesses...

UITP Summit 2025 – June 15 -19, 2025, booth A1350, hall A1 “Transform Urban Mobility for Everyone” at booth A1350 in Hall A1 Highlights include Signaling X, Train2Cloud, CBTC, Digital Station, RailXplore, software solutions and customer services offerings. Panel discussions with Michael Peter, CEO of...

When we think about industrial revolutions, the mind conjures images of steam engines, assembly lines, and robotic arms tirelessly performing tasks once done by hand. But what if the next industrial evolution isn’t just about machines getting smarter—it’s about making sure humanity evolves with them? That’s the vision of Industry 5.0, where technology doesn’t simply automate—it collaborates....

Kona Right-Angled SIL Power Connectors The Kona high-reliability range has been expanded with the new right-angle, single-in-line (SIL) power connectors. This range extension includes angled thru-board and cable options, along with EMI shielding, enhancing system design flexibility for aerospace, defense, and other high-performance applications - increasing the Kona line-up by over 30%.

The Internet of Things (IoT) is entering a new era—one where billions of connected devices must communicate reliably, instantly and continuously. Smart, connected technologies have already permeated the market, with billions of devices like video doorbells, smart home appliances, adaptive lighting and climate control systems in use today. As 5G networks continue to roll out, both the...

While Surface Mount Technology (SMT) dominates today’s electronics manufacturing headlines, Robotas Technologies Ltd. continues to lead the charge in advancing Through-Hole Technology (THT) assembly. With decades of experience and innovation behind it, Robotas offers intelligent solutions that meet modern production challenges, including its flagship Mascot System and advanced VERIFY inspection module. As many manufacturers...

Murata Manufacturing announced the launch of the FTI Series (FTN21XH502F0SRU), a groundbreaking NTC thermistor that sets a new industry standard for automotive thermal management. The product is the world’s first to achieve both a resin-molded design and wire-bonding compatibility in a single thermistor. The integration of these two innovations provides unprecedented flexibility for designing and assembling printed...

Infineon Technologies AG expands its PSOC 4 HV microcontroller (MCU) platform by introducing the PSOC 4 HVMS product family. The new family is optimized for space-constrained sensing or actuator applications by integrating high voltage functionality and advanced analog sensing capabilities into a standard microcontroller for connecting to the car-battery and vehicle-network with minimal external components needed.