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TDK adds SmartMotion for Smart Glasses to its custom sensing solutions for AI glasses and augmented reality

SmartMotion
Highlights: TDK’s advanced motion tracking IMU with an embedded machine learning solution enables responsive, motion context-aware smart eyewear for augmented reality and seamless AI accessibility in wearables New custom IMU with BalancedGyro and on-chip sensor fusion offers high precision head orientation tracking, optical/electronic image stabilization, and intuitive UI control...

DENSO and TÜV Rheinland Japan Sign MoU to Realize Sustainable Product Development and to Promote Digital Product Passport

DENSO Corporation
Denso Corporation (Headquarters: Kariya City, Aichi Prefecture; President: Shinnosuke Hayashi, hereinafter referred to as "DENSO") and TÜV Rheinland Japan, Ltd. (Headquarters: Yokohama City, Kanagawa Prefecture; President: Kunihiro Okamoto, hereinafter referred to as "TÜV Rheinland Japan") are pleased to announce that DENSO and TÜV Rheinland Japan have signed a memorandum of understanding in order to realize sustainable manufacturing...

HP protects highly secure workplaces with R&S®Trusted Disk from Rohde & Schwarz Cybersecurity

R&S®Trusted Disk
For its first workplace solution that meets the strict requirements for the VS-NfD (classified information – for official use only) security standard set by the German Federal Office for Information Security (BSI), HP is relying on R&S®Trusted Disk hard disk encryption from Rohde & Schwarz Cybersecurity. The package solution HP Sure Station consisting of...

Mouser Electronics Keynote Sponsor of All About Circuits’ Virtual Summit Series

Virtual Summit Series
Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, announces that it is a Keynote sponsor of All About Circuits' Virtual Summit Series 2025, an online industry event filled with live sessions from experts. The free summit is the evolution of Industry Tech Days — the largest virtual event for electrical...

Fujitsu and AIST sign collaboration agreement to strengthen international industrial competitiveness in quantum technology

Fujitsu and AIST Partnership
Fujitsu Limited and the Global Research and Development Center for Business by Quantum-AI technology (G-QuAT) at the National Institute of Advanced Industrial Science and Technology (AIST) announced the signing of a collaboration agreement to strengthen international industrial competitiveness in quantum technology. The agreement, signed on September 26, 2025, aims to enhance cooperation between the two organizations, thereby...

How To Choose: 3 Carrier Board Options Based on Rockchip RK3506J—–Stamp-Hole, Board-To-Board Connection and Mini Board

Forlinx Embedded
RK3506J Development Board: OK3506J-S/C offer cost-effective, low-power, industrial-grade solutions with rich I/O, long-term support, and rapid prototyping while OK3506-S12 Mini is a budget-friendly platform for developers to test features and validate functions before scaling up. The latest Rockchip RK3506 with its high performance, low power consumption and rich interfaces has...

India’s Largest Hand Tools, Power Tools and Fasteners Expo 2025 opens in Mumbai

Hand Tools, Power Tools and Fasteners Expo 2025
Highlights: 150+ Leading Brands and Global Pavilions Drive Strong International Participation at HTF 2025 'Grip & Grow' Networking Meet strengthens partnerships between Distributors, OEMs and Trade Professionals India's Hand Tools market to reach USD 1.22 billion by 2033, driven by Infrastructure and MSME Growth

Next-Generation VITA 91 MIL HD2 Connector Now Available from Amphenol Socapex

MIL HD2 Connector
Amphenol Socapex announces the launch of the VITA 91: MIL HD2, a cutting-edge COTS interconnect system designed for military and aerospace embedded systems. Selected by the SOSA / VITA consortium, this new connector series delivers the performance and density required for next-generation switch and payload card applications. With scalable data rates up to 56...

Littelfuse Launches IX3407B Isolated Gate Driver to Simplify High-Power Designs

IX3407B
Littelfuse, Inc. a diversified industrial technology manufacturing company empowering a sustainable, connected, and safer world, announced the release of the IX3407B, a single-channel, galvanically isolated gate driver designed to deliver high-speed switching performance and simplified system design in high-voltage power applications. The IX3407B gate driver delivers up to 7 A peak source and sink output...

Snapdragon 8 Elite Gen 5, the World’s Fastest Mobile System-on-a-chip

Snapdragon 8 Elite Gen 5
Highlights: The 3rd Gen Qualcomm Oryon CPU is the fastest mobile CPU ever. With state-of-the-art performance, efficiency and on-device AI processing, Snapdragon 8 Elite Gen 5 is purpose-built to amplify mainstay experiences and debut breakthrough experiences. The latest premium offering in the Snapdragon 8 Elite series will be...

Interview