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Essemtec Expands U.S. Presence with New, Larger Demo Lab in Burlington, MA

Essemtec Demo Lab in Burlington
Essemtec Demo Lab in Burlington, MA Essemtec, a global leader in adaptive and highly flexible SMT pick-and-place and dispensing equipment, with in particular All-in-One Solutions embedding dispensing, mounting and 2D inspections in one equipment, is proud to announce the opening of its brand-new demo center in Burlington, Massachusetts. Less than 18 months after...

Moxa Joins The Open Group Open Process Automation Forum to Shore Up Industrial Automation With Open, Vendor-neutral Technology Standards

OPAF- Open Process Automation Forum
Moxa Inc., a leader in industrial communications and networking, is excited to announce its participation in the Open Process Automation Forum (OPAF) as a silver member of The Open Group, a global consortium that leads the development of open, vendor-neutral technology standards and certifications. This involvement underscores Moxa's ongoing commitment to collaborating with industry leaders to promote...

TE Connectivity’s GRACE INERTIA Multi-Load Connectors, Now Shipping from Mouser, Set New Standard in Space-Saving Connections

GRACE INERTIA Multi-Load Connectors
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, is now stocking the GRACE INERTIA Multi-Load Connectors from TE Connectivity. TE Connectivity's GRACE INERTIA Multi-Load Connectors provide design flexibility for Printed Circuit Board (PCB) manufacturers requiring multi-functionality in wire-to-board solutions. These connectors feature a 14.1mm low mating...

Indium Corporation to Feature Power Electronics Solutions at SEMICON Southeast Asia 2025

Indium Corporation
Power Electronics Solutions at SEMICON Southeast Asia 2025 As a trusted leader in materials science for advanced electronics assembly, Indium Corporation is proud to showcase its innovative power electronics solutions at SEMICON Southeast Asia 2025, May 20–22, in Marina Bay Sands, Singapore. Indium Corporation is a trusted expert in power device packaging, delivering...

Asahi Kasei Microdevices and Dirac Partner to Meet Growing Demand for High-Fidelity In-Car Audio Performance

AKM's DSP flagship AK7709
Leading semiconductor manufacturer Asahi Kasei Microdevices (AKM) and Swedish digital audio pioneer Dirac have announced a partnership to integrate Dirac's smart acoustics solutions, AudioIQ, into AKM's line of automotive audio digital signal processors (DSPs), including its flagship AK7709, to significantly reduce tuning time while enhancing sound quality within vehicle interiors. This collaboration brings a...

Conduct Accurate Testing with High-Frequency 2.4 mm to 2.92 mm Adapters

2.4 mm to 2.92 mm Adapters
Amphenol RF is pleased to introduce the new high-performance 2.4 mm plug or jack to 2.92 mm jack adapters into our extensive and all-encompassing adapter portfolio. This adapter enables seamless connectivity between 2.4 mm plugs and jacks as well as 2.92 mm jack interfaces. They support high frequencies of DC to 40 GHz while maintaining minimal signal...

Renesas Extends RZ/A MPU Line-up with RZ/A3M for Cost-Sensitive, Advanced HMI Solutions

RZA3M MPU
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced a new high-performance microprocessor (MPU) in the RTOS-based RZ/A series that meets the growing demands of advanced human-machine interface (HMI) systems. The new RZ/A3M MPU comes with large SDRAM, SRAM and RTOS support to facilitate the seamless execution of complex tasks and real-time graphical displays. The...

STMicroelectronics completes GSMA certification for ST4SIM-300 eSIM for IoT

ST4SIM-300 eSIM
GSMA certification for ST4SIM-300 eSIM for IoT STMicroelectronics has completed certification of its ST4SIM-300 embedded SIM (eSIM) to GSMA SGP.32 eSIM IoT specification. Certification assures interoperability with cellular networks and IoT service platforms worldwide, with remote provisioning and easy switching between network providers. The ST4SIM-300 is among the first certified eSIMs to support SGP.32, the...

Infineon gains approval of Science Based Targets initiative for ambitious CO2 emission reduction targets

Elke Reichart
Scope 1 and 2 targets meet highest SBTi standard for near-term reduction goals Infineon sets ambitious scope 3 target to further reduce emissions along the supply chain Active work with over one hundred suppliers to further reduce emissions Infineon Technologies AG has reached another...

STMicroelectronics to showcase Edge AI and automation solutions at SEMICON Southeast Asia 2025

SEMICON Southeast Asia 2025
SEMICON Southeast Asia 2025 More than 10 exciting demos addressing Edge AI and sensors, wireless connectivity, automotive, and factory-automation solutions ST will be speaking on Advanced Packaging, Sustainability, MEMS for Medical Applications, and Talent Acquisition STMicroelectronics (NYSE: STM), a global semiconductor leader serving...

Interview