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Netskope Continues to Expand Collaboration with Microsoft, Providing Enterprise Security for Modern AI and Cloud Environments

Netskope
Netskope, a leader in modern security and networking for the cloud and AI era, announced the general availability of enterprise security and AI integrations with Microsoft. The seamless integration of Netskope One capabilities with Microsoft tools delivers flexibility for modern AI and cloud environments, protecting Microsoft customers that seek to maximise their security posture.

NEOTech Announces Acquisition by Arkview Capital

NEOTech
NEOTech, a leading provider of advanced electronic manufacturing services, announced its acquisition by Arkview Capital, a private equity firm headquartered in Stamford, Connecticut. Following an extensive search for the right strategic partner, NEOTech selected Arkview Capital for its proven track record of success and its team of operational experts with deep industry expertise. This...

Why AI Fails Small Businesses: Resolving the Readiness Gap

AI
AI Doesn't Fix Chaos: How to Stop AI from Overwhelming Your Operation Across the U.S., small businesses and nonprofits are facing unprecedented operational pressure. Inflation, tightening labor markets, shifting donor and consumer expectations, and rapid digital transformation have created a landscape where organizations must do more with fewer resources. At the same time, AI...

Aluminum Options Added to Same Sky’s Knobs Accessories Line

aluminum knobs
Same Sky’s Motion and Control Group announced the addition of aluminum knobs to its knobs product line. The SAK family of aluminum knobs is compatible with Same Sky’s range of rotary potentiometers and panel mount incremental encoders featuring D-cut shafts. Available in diamond knurled, knurled, or smooth shaft types, these aluminum knobs offer a variety of...

18nm STM32V8 MCU: High-performance microcontrollers with advanced phase-change embedded memory

STM32V8 MCU: High-performance microcontrollers
STM32V8 is the first microcontroller designed using next-generation 18nm FD-SOI technology, with advanced phase-change embedded memory (PCM) Selected by SpaceX for high-speed connectivity system in Starlink satellite network Perfectly fitted for the most demanding industrial applications such as factory automation, motor control and robotics

New 12-slot LXI/USB chassis delivers highest PXI slot density and lowest cost-per-slot

LXI/USB chassis
12-slot LXI/USB chassis: Pickering Interfaces, the leading supplier of modular signal switching and simulation solutions for use in electronic test and verification, has announced a new compact 12-slot LXI/USB modular chassis: the 60-107-001. The highest PXI slot density chassis for PXI and PXIe modules, it provides 12 hybrid-compatible slots in a 2U form factor, and can...

CEA-Leti to Launch Multilateral Program to Accelerate AI with MicroLED Data Links

Multilateral Program
CEA-Leti is launching a multilateral program on microLED technology for ultra-fast data transfer, with a particular focus on accelerating artificial intelligence (AI) growth. The lab- to-fab initiative draws on the institute's deep expertise in microLED process technology. The three-year initiative was announced today at SEMICON Europa in Munich. Set to begin in January 2026,...

ASDC Inaugurates Skill Exhibition & Try-a-Skill Zone at DIDAC India 2025; Highlights AR Simulators for Training

DIDAC India 2025
Automotive Skills Development Council (ASDC) inaugurated its Skill Exhibition & Try-a-Skill Zone today at DIDAC India 2025, held at Yashobhoomi – India International Convention & Expo Centre, New Delhi. The three-day showcase aims to promote future-ready, technology-driven skill development in India's automotive ecosystem, drawing strong participation from students, educators, industry leaders, and training partners.

congatec to showcase application-ready embedded solution platforms at EdgeTech+ Japan 2025

congatec
congatec – a leading provider of embedded and edge computing technology – will be exhibiting at EdgeTech+ 2025 in Yokohama, Japan, from November 19 to 21, 2025. At Booth CS-12, visitors can experience congatec’s latest solution platforms built on standards-based Computer-on-Modules, designed to simplify the use of embedded technology. congatec's focus at EdgeTech+ Japan...

congatec and Qualcomm collaborate to drive the next technology wave with high-performance Qualcomm Dragonwing platforms

Congatec
congatec – a leading vendor of embedded and edge computing technology – announced a technology collaboration with Qualcomm Technologies, Inc. that will speed the commercialization of high-performance embedded edge AI applications for size, power, and weight (SWaP) constrained industrial products based on Qualcomm Dragonwing processors. In a first step, the technology collaboration unlocks the versatility of congatec’s application-ready COM-HPC Mini Computer-on-Modules portfolio for developers...

Interview