Integrated, high sensitivity, current sensor IC for <5 AMP applications by Allegro
Allegro MicroSystems, LLC introduces Allegro's first fully integrated, GMR-based current sensor IC with ultra-high sensitivity for applications that require <5 A current sensing. Allegro's ACS70331 current sensor IC incorporates giant magneto-resistive (GMR) technology that is 25 times more sensitive than traditional Hall-effect sensor ICs to sense the magnetic field generated by the current flowing through the low resistance, integrated primary conductor....
GLOBALFOUNDRIES Strengthens 22FDX eMRAM Platform with eVaderis’ Ultra-low Power MCU Reference Design
GLOBALFOUNDRIES and eVaderis today announced that they are co-developing an ultra-low power microcontroller (MCU) reference design using GF's embedded magnetoresistive non-volatile memory (eMRAM) technology on the 22nm FD-SOI (22FDX) platform. By bringing together the superior reliability and versatility of GF's 22FDX eMRAM and eVaderis' ultra-low power IP, the companies will deliver a technology solution that supports a broad set of applications such...
Indian Semiconductor component market will grow USD 32.35 billion by 2025: IESA Semiconductor Fabless Startup report
The report on global semiconductor industry launched at the 13th edition of IESA’s Vision Summit also analyzed:
- Fabless ecosystem and emerging trends in the Indian semiconductor industry
- Potential of Indian fabless players in the semiconductor ecosystem and current pain points in the industry and provide possible solutions
- Role of governments and opportunities for private players and compare the policies for critical success factors...
Digitalization is not an option, but a Must: B&R India explores IIoT topics at 4th annual Innovation Day
The fourth edition of B&R India's "Innovation Day" once again provided a platform for thought leaders, industry experts and decision makers to share ideas on the Industrial IoT, smart manufacturing, design efficiencies, Industry 4.0 and digitalization. This year's event welcomed more than 200 attendees with a mix of technical presentations, live demos and a panel discussion – whose members...
Next-Generation FPGA Software for Development of Broad Market Low Power Embedded Applications by Lattice
Next-generation FPGA software offers rapid design exploration, ease of use, and timing closure capabilities for broad market low power embedded applications
New software enhances Lattice soft IP portfolio with IP core support for the iCE40 UltraPlus family
Lattice Radiant is available for download from the company’s website free of charge; along with documentation and training videos
Lattice Semiconductor Corporation, the leading provider...
Reduce Evaluation Time of Industrial Networking Applications with Renesas’s Solution Kit for Remote IO & Communication Modules
Renesas Electronics Corporation , a premier supplier of advanced semiconductor solutions, today announced its latest solution kit based on the RZ/N1L Group of microprocessors (MPUs). In addition to the RZ/N1D Group for high-end processors for master devices including Programmable Logic Controller (PLC) and the RZ/N1S Group for mid-range devices including Human Machine Interface (HMI), the RZ/N Series includes the RZ/N1L Group, which is optimized for...
Rohde & Schwarz and CommSolid present world’s first test solution for 3GPP Release 14 location services for NB-IoT
Rohde & Schwarz and CommSolid have successfully completed the verification of 3GPP Release 14 location services (LCS), which is one of the new positioning technologies for NarrowBand-IoT (NB-IoT). The Cat-NB2 verification was performed with CommSolid’s NB-IoT modem solution against the R&S CMW500 mobile communication tester. The R&S Location Based Services (LBS) solution based on R&S CMWcards GUI, a subset of TS-LBS, allows the verification of chipsets...
10nm pattern generation using thermal scanning probe lithography enabled by simplified materials and processes
Thermal scanning probe lithography (tSPL) has been used to create patterns with sub-20 nm half pitch resolution. Pattern generation uses a thermally sensitive resist and spin coatable hard mask materials to transfer the resist patterns. Spin coatable materials permit users of tSPL to reduce time and cost of the patterning process.
NanoFrazor lithography
Thermal scanning probe lithography (tSPL), also termed NanoFrazor...
3GPP-Compliant Reference Test Solution for Sub-6 GHz 5G New Radio by NI
NI , the provider of platform-based systems that enable engineers and scientists to solve the world’s greatest engineering challenges, announced a sub-6 GHz 5G test reference solution compliant with the 3GPP Release 15 specification for 5G New Radio (NR).
With commercial 5G NR deployments below 6 GHz on the horizon, engineers are actively developing sub-6 GHz 5G RF components and...
LMD leads revolution in smartphone as medical device, driving growth of remote medical consultation
Leman Micro Devices (LMD), the developer of regulated consumer healthcare products that is backed by major players within the mobile device industry, has announced that its V-Sensor and App integrated with next-generation smartphones will assist diagnosis by physicians and drive growth in remote medical consultation services by enabling patients to self-measure their own vital signs with medical accuracy for...