TI’s university robotics kit & curriculum prepare future engineers for systems-level design
In India, the field of robotics is increasing in popularity as a career path as more students learn about the integration of systems and engineering disciplines. To stay competitive in this world of increasing complexity and efficiency, today’s engineering students must graduate with an understanding of engineering concepts across multiple disciplines and products. To equip future engineers with this...
Renesas Synergy platform enhanced IoT performance with IAR systems Compiler Technology
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced an enhancement to its e² studio integrated development environment (IDE) tool for the Renesas Synergy Platform. Through its ongoing partnership with IAR Systems, the leading embedded development tools supplier, Renesas Synergy customers can now enjoy significant performance benefits by integrating IAR Systems’ advanced IAR C/C++ Compiler into...
To Strengthen Connectivity Business, DENSO Takes a Stake in CREATIONLINE
DENSO Corporation today announced that it has taken an equity stake in CREATIONLINE, Inc., which excels at deploying and integrating cloud and other technologies that enable next-generation software development, including open source software.
The auto industry is undergoing a once-in-a-century paradigm shift. Competition continues to intensify as new players from other industries enter the market and as speed to market...
Supporting Innovation & Entrepreneurship: Infineon signs Agreement with NITI Aayog’s Atal Innovation Mission
Infineon will share design, manufacturing experiences and knowledge in semiconductor systems in support of Atal Innovation Mission (AIM), a flagship programme of the Government of India. To this purpose, Infineon Technologies AG and AIM of NITI Aayog have signed an agreement today. It aims at encouraging innovation and entrepreneurship amongst innovators, incubators and start-ups.
Infineon will provide mentoring support, workshops...
Family of 2D Hall-effect speed & direction sensor ICs released by Allegro MicroSystems
Allegro MicroSystems, LLC announces the release of a new family of 2D Hall-Effect Latch ICs that feature both vertical and planar Hall elements. The APS12625 and APS12626 sensor ICs enable reduced system size and bill-of-materials (BOM) cost along with an increase in performance and flexibility due to 2-dimensional (2D) sensing. They were developed in accordance with ISO 26262 and qualified per AEC-Q100,...
CommAgility LTE systems chosen by Lockheed Martin for satcom project
CommAgility, a Wireless Telecom Group company , announces that it is has been selected by Lockheed Martin to supply integrated software and hardware for an innovative satellite communications (satcom) project.
CommAgility is supplying a customized version of its SmallCellPHY software, which is a complete LTE physical layer for small cells, compliant with 3GPP Release 10. The LTE software will run on CommAgility's AMC-D24A4-RFx processing/RF...
Rohde & Schwarz comprehensive EMC test & measurement solutions at EMV 2018
At EMV 2018, Rohde & Schwarz will present its customized solutions for EMC measurements in all areas of product development, from the R&D phase to certification. A turnkey test system for certification testing in line with RED as well as complete systems for immunity measurements will also be on display.
As a leading manufacturer of EMC test and measurement equipment, Rohde...
DC/DC Buck Regulators feature Electromagnetic Interference & Thermal Performance
Texas Instruments (TI) introduced two families of wide-VIN synchronous DC/DC buck regulators with industry-leading electromagnetic interference (EMI) and thermal performance. The highly integrated 5-A and 6-A LM73605/6 and 2.5-A and 3.5-A LM76002/3 step-down voltage converters feature an optimized pinout and best-in-class thermal coefficient to simplify the process of achieving EMI compliance and higher reliability for rugged industrial and automotive...
New Test Platform to Support Qualcomm Technologies’ 5G Chipset Development by Anritsu
Anritsu Corporation announces its new 5G test platform to help support test development for Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, on 5G chipsets.
Anritsu, a leader in mobile communications testing, is working with Qualcomm Technologies to support test development for devices such as baseband chips. Anritsu’s test platform for 5G, the next generation communication system beyond 4G LTE,...
NSR’s China Satellite Markets Report Forecasts Aggressive Chinese Exporting
NSR’s industry-first China Satcom Markets (CSM) report, released today, finds a Chinese satellite industry primed to take a larger share of the global satcom market through attractive one-stop-shop offerings, aggressive growth plans and enhanced exports. For GEO-HTS satellites alone, NSR forecasts Chinese state-owned companies to manufacture and launch over 800 Gbps of capacity by 2026, with much of this coming over...