Electronicsmedia

RS Components (RS), the trading brand of Electrocomponents plc (LSE: ECM), a global multi-channel provider of industrial and electronic products and solutions, has announced availability of two new PSoC® 6 prototyping kits from Cypress Semiconductor Corp.: the first for Wi-Fi and Bluetooth IoT development and the second for BLE (Bluetooth Low Energy) based IoT applications. Along with advanced connectivity, the two...

2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI and datacenter as for today”, confirms Mario Ibrahim, Technology & Market Analyst from Yole Développement (Yole). Stacking technologies are used in a variety of hardware, including 3D stacked memory, GPU , FPGA , and CIS , are intended for the high/mid and low-end market segments. Hardware...

STMicroelectronics for less than $10, the STM8-SO8-DISCO 8-bit microcontroller (MCU) Discovery Kit from STMicroelectronics lets users evaluate all three STM8 variants currently available in the popular 8-pin SO8 package. As well as outstanding three-in-one value, the kit offers no-frills simplicity and features to jump-start the next stage of development. There is a single button and indicator LED for interacting with the board,...

Mouser Electronics is now stocking the QPF4528 front end module (FEM) from Qorvo. Designed for Internet of Things (IoT) systems based on Wi-Fi 6, the 5 GHz FEM offers a compact form factor and integrated matching to minimize layout area in applications such as wireless routers, set top boxes, and access points. Qorvo’s QPF4528 FEM integrates a 5 GHz power...

Thalia Design Automation introduces advanced analog schematic porting capabilities within its AMALIA analog design automation tool suite. Configured for users of TSMC, Global Foundries, UMC, SMIC, and in-house technologies of Tier 1 design companies, the AMALIA schematic porting capability is already proven in analog migration projects to achieve design time savings of up to 50%. Sowmyan Rajagopalan, Thalia Founder and CTO, commented: "Process...

Alpha and Omega Semiconductor Limited introduced  AOZ6662DI-01 and AOZ6663DI-01, high efficiency, simple-to-use synchronous buck regulators. The AOZ6662DI-01 and AOZ6663DI-01 are both available in a thermally enhanced  DFN3x3 exposed pad package, delivering an output current of 2A and 3A, respectively. The new devices offer a low on-resistant power stage, allowing cooler power conversion for a variety of consumer electronics application such as LCD TVs,...

Vishay Intertechnology introduced a ceramic mid-power ultraviolet (UVC) emitting diode for sterilization, sanitation, and purification applications. Featuring a quartz window, the Vishay Semiconductors VLMU35CM..-280-120 delivers an extremely long life-time in a compact 3.5 mm by 3.5 mm by 1.2 mm surface-mount package. Designed to replace mercury UVC lamps, the device released today offers an emission angle of ± 60° and radiant power...

Leti, an institute of CEA-Tech, has developed a novel retinal-projection concept for augmented reality (AR) uses based on a combination of integrated optics and holography. The lens-free optical system uses disruptive technologies to overcome the limitations of existing AR glasses, such as limited field-of-view and bulky optical systems. TVs and smartphones that project digital images emit light all around them, as quasi-isotropic...

Excelfore, an enabler of smart mobility networks, announces a working Time Aware Shaper (TAS) for Ethernet TSN networks. As in-vehicle networking continues to grow in importance, Ethernet is becoming an increasingly popular platform providing secure, high-speed, inexpensive solutions. To meet automotive requirements for deterministic network behavior, new protocols must be added onto Ethernet stacks to provide Audio/Video Bridging (AVB) and...

LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over. Infineon’s REAL3 image sensor chip will play a key role in the front-facing camera of the upcoming LG G8ThinQ, to be unveiled in Barcelona during Mobile World Congress 2019. Building upon the combined expertise of Infineon and...