Flex Power Modules broadens DC-DC power modules portfolio for industrial & railways sectors
Broad range of voltages and features to meet the needs of many diverse applications
Encapsulated packaging for reliable operation in harsh conditions
Flex Power Modules builds on reputation in ICT market with new capabilities for industrial and railways sectors
Flex Power Modules is introducing new DC-DC power modules for the industrial and railways sectors, broadening its product range to...
Audio front-end development kit for Amazon AVS supports far-field voice interaction
From wearables to smart lighting, voice control is increasingly becoming consumers’ preferred way to interact with electronics. As developers build products of various sizes and designs to meet consumer demand, they often have trouble scaling to meet different Bill of Materials (BOM) and form factor requirements in end applications. Microchip Technology Inc., via its Microsemi Corporation subsidiary, has announced...
Buck Converters & Controllers for Most Efficient High-Voltage Automotive Power Solutions
Maxim Integrated Products announced power-management ICs offering the industry’s smallest solution size and highest efficiency to help automotive designers meet space and power challenges of next-generation automotive applications. As digital instrument clusters, radio head units and electronic subsystems require ever higher levels of compute power, these new high-power buck converters and high-power, multiphase buck controllers empower designers to balance low...
AAEON Partners with Gorilla Tech to Showcase High-Performance A.I. Computing at CES 2019
AAEON, the leading designers and manufacturers of IoT and A.I. edge computing platforms, and Gorilla Technology Group, the global leader specializing in video intelligence and IoT technology, jointly demonstrated their A.I. (artificial intelligence) computing capability in featured smart transportation solutions at Intel booth during CES 2019.
CES (Consumer Electronics Show) is the world stage of leading technological innovations, annually held in...
Cree & STMicroelectronics Announce Multi-Year Silicon Carbide Wafer Supply Agreement
Cree announces that it signed a multi-year agreement to produce and supply its Wolfspeed silicon carbide (SiC) wafers to STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications. The agreement governs the supply of a quarter billion dollars of Cree’s advanced 150mm silicon carbide bare and epitaxial wafers to STMicroelectronics during this period of extraordinary growth...
Keysight Technologies Delivers Professional Functionality in Entry-Level Oscilloscope
Keysight Technologies, announced the 200 MHz, 4-channel models of the InfiniiVision 1000 X-Series oscilloscopes, providing professional-level measurements and capabilities at an affordable price, including 4-wire Serial Peripheral Interface (SPI) decode and remote connection via local area networks (LANs).
The new InfiniiVision 1000 X-Series oscilloscopes use the same user interface and measurement technology found in the higher performance Keysight InfiniiVision oscilloscopes. The intuitive front panel is...
1-Port USB Wall Chargers Accounted for 5 in 10 Units Sold in 2018, Fragmented Landscape Inducing Pricing Pressures
Backed by modest sales of over 76 thousand units, the USB wall charger market grew at 5.3% y-o-y in 2018, reveals Fact.MR’s new study. According to the study, the USB wall charger market is witnessing a shift from USB-A type to USB-C type charger. While a handful of manufacturers have implemented the type C USB functions in their devices, the advantages that this...
Alliance Memory Cuts Lead Times for Automotive Temperature DRAM Portfolio
Alliance Memory announced that it has greatly reduced lead times for its DRAMs with -40°C to +105°C automotive temperature ratings. Responding to customer demand, Alliance Memory now holds many parts in finished goods stock and in addition can promise lead times of just six weeks for its most popular automotive temperature range products.
Alliance Memory offers a complete lineup of automotive...
Rohde & Schwarz Unveils New Features of Deep Packet Inspection Solution for vEPC Market
R&S PACE 2 DPI helps vEPC vendors boost competitive advantage by easily and reliably detecting and classifying thousands of applications and attributes
Leipzig, Germany – January 8, 2019 – ipoque GmbH, a Rohde & Schwarz company providing market-leading deep packet inspection (DPI) software, today announced new R&S®PACE 2 capabilities for the virtualized evolved packet core (vEPC) market. The high-performance DPI product offers...
STMicroelectronics Announces Timing for Fourth Quarter / Full-Year 2018 Earnings Release and Conference Call
STMicroelectronics announced that it will release fourth quarter/full year 2018 earnings before the opening of trading on the European Stock Exchanges on Thursday, January 24, 2019.
The press release will be available immediately after the release on the Company’s website at www.st.com.
STMicroelectronics will conduct a conference call with analysts, investors and media to discuss its fourth quarter/ full year 2018 financial...















