SIMO PMICs Shrink Power Regulator Size in Half for IoT Devices
Designers of small, battery-powered electronics can enhance the user experience by extending battery life and further shrinking device size with six new low-power power-management integrated circuits (PMICs) from Maxim Integrated Products. The MAX17270, MAX77278, MAX77640/MAX77641 and MAX77680/MAX77681 PMICs help to reduce the power-management footprint by up to 50 percent for space-constrained products such as wearables, hearables, sensors, smart-home automation...
Mouser Electronics and Terabee Sign Global Distribution Agreement
Mouser Electronics, Inc., the New Product Introduction (NPI) leader empowering innovation, announces a global distribution agreement with Terabee, designers of small, high-performance distance sensors for the drone, robotics, and IoT applications. Through the agreement, Mouser is now shipping a variety of Terrible's TeraRanger sensors.
The TeraRanger Evo distance sensors measure a single axis and return distance values in millimeters at...
1 MBd High Speed Optocouplers with Schmitt-Trigger Functionality
Vishay Intertechnology introduced a new series of 1 MBd high speed optocouplers featuring an open collector transistor output with Schmitt-Trigger functionality for easy integration into digital systems. VOH1016A series devices provide a low typical turn-on threshold current of 0.65 mA and maximum supply current of 1.0 mA, and are designed for programmable logic controllers, serial data communication and bus...
Industry’s first RISC-V SoC FPGA Architecture brings real-time to Linux
In a new era of computing driven by the convergence of 5G, machine learning and the internet of things (IoT), embedded developers need the richness of Linux-based operating systems. These must meet deterministic system requirements in ever lower power, thermally constrained design environments—all while addressing critical security and reliability requirements. Traditional system-on-chip (SoC) field programmable gate arrays (FPGAs) blending...
TI’s GaN Modules, Available from Mouser
Mouser Electronics, Inc., the industry's leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, stocks the full line of gallium arsenide (GaN) modules from Texas Instruments (TI).
TI’s GaN controllers, regulators, and drivers deliver reduced power with end-to-end power conversion and 5 MHz switching frequencies for high-performance applications such as electric motor design, augmented...
TomTom on ST Platforms, Track Assets with ST GNSS/GPS Expansion Board
The new STM32ODE Function Pack, the FP-ATR-TOMTOM1 is the first software package for embedded systems to bring multiple TomTom Maps APIs to IoT development platforms, and STMicroelectronics announced that, the X-NUCLEO-GNSS1A1 GNSS/GPS expansion board built around Teseo-LIV3F, and that is at the center of this Function Pack, is now available at online retailers or on ST store for $35.
Thanks to a collaboration between ST and TomTom,...
ON Semiconductor’s Smart Passive Sensors Awarded For Outstanding Technical Innovation
ON Semiconductor has been awarded an IoT Outstanding Technical Innovation Award for its Smart Passive Sensors (SPS). SPS are wireless and battery-free sensors that enable the monitoring of various parameters and, coupled with the company's SPSDEVK1MT-GEVK turnkey solution kit, enable rapid integration into IoT applications.
SPSDEVK1MT-GEVK is a predictive maintenance turnkey solution kit that integrates 20 SPS1T001PCB temperature sensors, 20 SPSxT001PET temperature sensors, 20 SPSxT001CER temperature sensors, 20 SPSxM001PET moisture sensors, a 12...
Rohde & Schwarz and Huawei conduct field trial precision latency measurements for 5G cellular V2X communication
One of the key use cases of 5G is ultra-reliable low-latency communication (URLLC). Important for advanced vehicle-to-X communication use cases, URLLC will enable automated driving in the future. In a joint project between Huawei and Rohde & Schwarz, a precision end-to-end delay measurement system for over-the-air IP transmissions was applied to 5G V2X communication for cooperative driving applications in...
3D CMOS Sequential Integration Closer to Commercialization
Leti, a research institute at CEA Tech, has reported breakthroughs in six 3D-sequential-integration process steps that previously were considered showstoppers in terms of manufacturability, reliability, performance or cost.
CoolCube, CEA-Leti’s 3D monolithic or 3D sequential CMOS technology allows vertically stacking several layers of devices with a unique connecting-via density above tens of million/mm2. This MoreMoore technology decreases dice area by a...
KRYON PARTNERS WITH MICROSOFT, ACHIEVES CO-SELL READY STATUS
KRYON a leading robotic process automation (RPA) solution provider known for its customer-centric approach and its unique technological innovations, including Kryon Process Discovery – today announced that it has earned Co-Sell Ready status through the Microsoft One Commercial Partner program. Kryon is now among an elite group of global independent software vendors selected by Microsoft for intensive joint sales,...
















