Electronicsmedia

Anritsu Corporation, is pleased to announce that along with eSIM test solution expert COMPRION, they have established an eSIMover-the-air (OTA) test environment using Anritsu’s Signalling Tester MD8475A and COMPRION eUICC Profile Manager. The verification of the test environment was done at the Certification Center Svyaz-sertificat, one of the representative certification bodies in Russia that provides full certification services. From January...

Mouser Electronics  is now stocking the SmartBond Multi-Sensor Kit from Dialog Semiconductor. The smallest and lowest power wireless sensor kit on the market, the kit is built on Dialog's DA14585 SmartBond system-on-chip (SoC) and integrates TDK InvenSense motion sensors and Bosch Sensortec environmental sensors for 15 degrees-of-freedom (DOF) in Internet of Things (IoT) applications. Dialog's SmartBond Multi-Sensor Kit is a complete multi-sensor node solution that enables engineers to...

What’s the first thing you do when trying out a new EDA tool for designing circuit boards?  If you’re anyone like me, you want to start dropping parts onto a schematic sheet to give it a test drive.  The first stop is the parts library.   It might differ between tools, but there’s a common theme.  Usually, it is a...

AAEON, a global leader in the development of innovative IPC solutions, launches the NANO-002, a mini PC with the power and flexibility to manage tough applications in the factory, office, and off-site locations. Fitted with a 6th generation Intel® Core™ or Celeron® 3955U CPU, the NANO-002 is a low-power-consumption unit with fast, dependable processing speeds. With the option of two...

Worldwide semiconductor manufacturing equipment billings reached US$16.7 billion in the second quarter of 2018, 1 percent lower than the previous record quarter and 19 percent higher than the same quarter a year ago, SEMI, the global industry association representing the electronics manufacturing supply chain, reported today. The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from...

element14 will be showcasing their latest range of products from Texas Instruments, Tektronix, and other leading partners at Engineering EXPO 2018, held at Auto Cluster Exhibition Center, Chinchwad in Pune from September 14th – 16th, 2018. Visitors to Stall No. 07, Hall A, will be able to see the latest kits and solutions available to product developers and design engineers focused...

Amphenol RF is pleased to introduce additional HD-BNC jacks to its already extensive line of 12G products. These products are aimed to support the rapidly growing need for faster processing and more space-conscious broadcast solutions. The extended line of HD-BNC Jacks includes PCB and cable mount products in the straight configuration. These 75 ohm 12G-SDI connectors are designed to perform...

ST Engineering announced the appointment of   Tom Vecchiolla as President & CEO (Designate) of its US Headquarters, VT Systems.  He will take over as President & CEO from General (Ret.) John Coburn on 1 December 2018, who will relinquish his CEO position but remain as non-executive Chairman of VT Systems. Gen. Coburn has been helming VT Systems for 17 years...

Rohde & Schwarz is pioneering 5G New Radio (5G NR) network measurements with the world’s first commercially available 5G NR network measurement solution. This solution enables users in the 5G network ecosystem as well as regulators to measure the 5G NR network coverage accurately – one of the biggest challenges in network planning. With this solution, users can also...

RS Components (RS), the trading brand of Electrocomponents plc (LSE:ECM), a global multi-channel distributor, has introduced a Cloud-enabled development kit that kick-starts IoT-sensing projects by allowing users to collect and analyse data on a dashboard within minutes after unboxing. The UrsaLeo UL-NXP1S2R2 kit contains a Silicon Labs Thunderboard 2 sensor module, ready to connect to UrsaLeo’s services platform in the Google Cloud. Pre-registered access helps...