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The Role of Quantum Computing in Shaping the Future of Automotive Industry Global Statistics

Quantum Computing
The global Quantum Computing in Automotive market is valued at USD 465.11 million in 2025, and is projected to reach USD 5.75 billion in 2035, registering a CAGR of approximately 28.6% over the forecast period. This projection reflects strong investor, OEM, and government interest in quantum technologies as automotive systems become more complex (e.g., for EVs, autonomous...

For more secure AI and ML models: Infineon’s OPTIGA Trust M backs Thistle Technologies’ Secure Edge AI solution

Secure Edge AI with OPTIGA Trust M
Infineon Technologies AG provides its OPTIGA Trust M security solution to Thistle Technologies for its new cryptographic protection for on-device AI models to its security software platform for embedded computing products based on the Linux operating system (OS) or on a microcontroller. The new capabilities in the Thistle Security Platform for Devices, along with Infineon OPTIGA Trust M...

Beware of dependence on US-based supply chains advises Anglia

Anglia supply chain risks advises
UK and European customers using supply chains that rely solely on overseas warehousing should be very wary of significant challenges, warns Anglia Components. Shipping parts around the world always increases carbon footprint. The two major 'high service' - or as John Bowman, Anglia's Marketing Director, refers to them, 'self service' – distribution players both ship...

Expanded range of microwave switching solutions from Pickering Interfaces on show at European Microwave Week 2025

microwave switching solutions
Pickering Interfaces, the leading provider of modular signal switching & simulation products for electronic test & verification, will showcase its extensive range of RF & microwave switching, including SPDT, transfer, MUX, and matrix switches with bandwidths from DC to 110GHz, available in PXI, LXI, and USB – as well as its expanded range of standard LXI microwave...

Infineon expands XENSIV MEMS microphone lineup delivering best-in-class audio and power performance

XENSIV MEMS
Infineon Technologies AG has expanded its XENSIV MEMS microphone lineup with the introduction of the IM72D128V and IM69D129F, two innovative digital PDM microphones designed for exceptional audio performance, energy efficiency, and robustness. Leveraging Infineon’s proprietary Sealed Dual Membrane (SDM) technology, both microphones achieve a high level of robustness against water and dust (IP57), making them suitable for...

ROHM Launches 2-in-1 SiC Molded Module “DOT-247”

DOT-247
ROHM has developed the "DOT-247," a 2-in-1 SiC molded module (SCZ40xxDTx, SCZ40xxKTx), ideal for industrial applications such as PV inverters, UPS systems, and semiconductor relays. The module retains the versatility of the widely adopted "TO-247" package while achieving high design flexibility and power density. The DOT-247 features a combined structure consisting of two TO-247...

Vishay Intertechnology Launches Industry’s First Automotive Grade Ceramic Capacitors With Y1 Rating in SMD Casing

Ceramic Capacitors
SMDY1 Automotive Series Ceramic Capacitors: Vishay Intertechnology, Inc. introduced a new series of Automotive Grade AC line rated ceramic disc safety capacitors that are the industry's first with a Y1 rating to be offered in a surface-mount casing. Combining their Y1 rating of 500 VAC and 1500 VDC with high capacitance to 4.7 nF, the...

Microchip Introduces Flexible New Family of Gigabit Ethernet Switches with TSN/AVB and Redundancy For Industrial Applications

Ethernet Switches
Ethernet technology provides the high-speed, reliable communication needed to connect and control industrial devices in real time. Its scalability and flexibility to support protocols such as TSN ensures seamless integration for demanding industrial environments.  Microchip Technology announces the launch of its next generation of LAN9645xF and LAN9645xS Gigabit Ethernet Switches with multi-port configurations and feature options for maximum reliability and...

Morse Micro and The Things Industries Demonstrate Easy Wi-Fi HaLow Backhaul for LoRaWAN Gateways, to be Showcased at The Things Conference 2025

Wi-Fi HaLow
Morse Micro, the world's leading provider of Wi-Fi HaLow silicon solutions, and The Things Industries, a global leader in LoRaWAN network solutions, announced a successful demonstration of Wi-Fi HaLow as a backhaul connection for LoRaWAN gateways connecting to The Things Stack Cloud. This breakthrough is being showcased at The Things Conference 2025, highlighting its potential to transform...

India Mobile Congress 2025 : VIAVI to unveil advancements in 6G, NTN, Quantum-safe and Open Networks

IMC 2025
IMC 2025: Viavi Solutions announced that it will highlight emerging innovations and demonstrate its advanced network test and optimization solutions at India Mobile Congress, October 8-11, New Delhi. India’s telecom ecosystem and expanding digital economy is making significant strides. Government’s strategic vision of self-reliance in next-generation communication technologies has created a collaborative platform to...

Interview