Electronicsmedia

Same Sky's Motion and Control Group announced the addition of hollow shaft ring encoders to its line of panel mount incremental encoders. The RING family of hollow shaft mechanical encoders is housed in packages from 23 mm up to 56.5 mm with low profile designs from 9.5 mm up to 20 mm. Offering hollow shaft diameters from 9 mm up to 38.5...

e-peas has announced it will attend Embedded World and showcase its advanced technologies that enable Original Equipment Manufacturer (OEM) and facility managers to develop battery-free IoT systems for smart building and smart home applications. Visitors to the e-peas booth (Hall 4A / Booth Number 4A-301) will see demonstrations and actual products of presence detectors,...

To make its robust programming and debugging capabilities accessible to a wider range of engineers, Microchip Technology has launched the MPLAB PICkit Basic in-circuit debugger to be a cost-effective, powerful solution for engineers at various levels. Unlike other complex and expensive debuggers, this budget-friendly device offers high-speed USB 2.0 connectivity, CMSIS-DAP support, compatibility with various Integrated Development...

Indium Corporation, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at IPC APEX EXPO 2025, taking place March 18-20 in Anaheim, California.  Indium Corporation will showcase among its featured products: Durafuse LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings,...

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, and Altium, a global leader in electronics design software, proudly announce the introduction of Renesas 365, Powered by Altium, a first-of-its-kind industry solution designed to streamline electronics system development from silicon selection to system lifecycle management. This transformative solution will be demonstrated at embedded world, Booth 5-371,...

The next Bluetooth release is expected to be ratified soon. One important new feature is the Unified Test Protocol (UTP) Test Mode for Bluetooth Low Energy, that will complement existing test methods. The UTP Test Mode will additionally enable over-the-air (OTA) controlled device testing, which will simplify measurements of small and highly integrated devices enormously, since no...

LTE IoT 10 Click is a compact add-on board that provides reliable LTE-M and NB-IoT connectivity for industrial and commercial IoT applications from MIKROE, the embedded solutions company that dramatically cuts development time by providing innovative hardware and software products based on proven standards. A new member of MIKROE’s 1750-strong mikroBUS -enabled Click board family, LTE IoT 10 Click features the Monarch GM02S, a low power and...

Power Integrations, the leader in high-voltage integrated circuits for energy-efficient power conversion, announced a two-fold increase in power output from the HiperLCS-2 chipset. Featuring advanced half-bridge switch technology and an innovative package, the new device can deliver up to 1650 W of continuous output power with over 98 percent efficiency. The new family member targets industrial power supplies as...

Vishay Intertechnology, Inc. announced that it has upgraded its VSOP383xx series of preamplifier circuits for infrared (IR) remote control applications in consumer products with the new Cyllene 2 IC. Offered in the 2 mm by 2 mm by 0.76 mm QFN package, the enhanced solutions provide drop-in, plug and play replacements for existing devices in the series while offering...

Smart glasses have long promised to disrupt the consumer market. Despite the initial hype, innovations remained limited to enterprise use as opposed to consumer everyday wear. When consumer devices started coming out, they were often very bulky for everyday wear and prolonged use. They also ran out of batteries quickly or needed to be connected to a...