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DENSO Signs Agreement to Transfer Part of Its Ceramic Product Business

DENSO Corporation
DENSO CORPORATION announced that its Board of Directors has resolved to transfer its Spark Plug and Exhaust Gas Sensor business (Oxygen Sensor and Air-Fuel Ratio Sensor), to Niterra Co., Ltd (hereinafter "Niterra"). The two parties reached a decision to sign the business transfer agreement during a board of directors meeting on September 1st, 2025. In...

Mouser Electronics Sponsors European Microchip MASTERs 2025 Conference

MASTERs 2025
Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is pleased to announce that it is a Sponsor of the European Microchip MASTERs 2025 Conference, which will be held October 28 to 30 at the Meliá Sevilla Hotel in Seville, Spain. Now in its 25th year, the Microchip MASTERs Conference is a premier technical...

Understanding the Rise of AI and Machine Learning Operationalization Software

AI and Machine Learning Operationalization Software Market
Artificial intelligence (AI) and machine learning (ML) models are powering real-time decisions across industries. However, moving models from development to production-ready systems is a complex process. This is where the AI and machine learning operationalization software market comes into play. These solutions bridge the gap between data science and IT operations by automating deployment, retraining, and governance of ML...

Quantum in Telecom

Stephen Douglas - Head of Market Strategy, Spirent Communications
Quantum is quickly moving from research to real-world relevance across telecom. From quantum-safe security to AI-assisted computing, operators are laying the groundwork for a range of applications. While quantum computing is often seen as a threat to encryption, it also promises major advances in areas like network optimization, secure communications, and large-scale simulations. Investments are underway across...

CG Power Inaugurates OSAT Semiconductor Facility in Gujarat

OSAT Semiconductor Facility in Gujarat
Union Minister of Electronics and Information Technology, Shri Ashwini Vaishnaw along with Chief Minister of Gujarat Shri Bhupendra Patel today inaugurated one of India’s first end-to-end Semiconductor OSAT Pilot Line Facility of CG Power at Sanand, Gujarat. The ceremony marks a historic beginning in India’s semiconductor journey under the visionary leadership of Prime Minister Shri Narendra Modi.

India’s first Tempered Glass Manufacturing Facility for Mobile Devices at Noida

Tempered Glass Manufacturing
Union Minister of Electronics and Information Technology Shri Ashwini Vaishnaw inaugurated India’s first Tempered Glass Manufacturing Facility for Mobile Devices at Noida. The facility has been set up by Optiemus Electronics in collaboration with Corning Incorporated, USA, and will produce high-quality tempered glass under the globally recognised brand “Engineered by Corning”. The products will be supplied to...

KYOCERA AVX’s Hybrid Couplers Deliver High-Frequency Performance in Miniature Packages, samples available from Anglia.

Hybrid Couplers
KYOCERA AVX’s has expanded its 3dB 90° hybrid couplers – the DB0402 adds a miniature 0402 size package to the family which already includes the DB0603, and DB0805 series – engineered to meet the growing demands of high-frequency wireless systems across industrial, automotive, telecommunications, and telemetry sectors. As wireless technologies continue to advance at pace, the need for components that can deliver...

Battery modules with lithium iron phosphate technology

Battery modules
The modules impress with their exceptionally high energy density and lightweight design – ideal for demanding industrial applications. In combination with the Quint4 UPS, they enable intelligent battery management that ensures maximum availability and operational safety. The battery modules are based on proven lithium iron phosphate technology and offer remarkable buffer performance: With a...

YINCAE Showcases High-Performance Materials at IMAPS 2025

YINCAE semiconductor materials
YINCAE, a global leader in advanced electronic materials, is set to showcase its latest innovations in underfill, die attach, and liquid metal technologies at IMAPS, San Diego, September 30 – October 1. Visitors will experience next-generation solutions designed to meet the reliability, thermal, and processing challenges of today’s most demanding electronic applications. Highlights at the IMAPS:

Introducing the SI02C065SMB – Robust Short-Circuit Protection for SiC MOSFETs

SI02C065SMB
As the demand for high-efficiency, high-frequency power electronics surges, especially in electric vehicles (EVs), solar inverters, and telecommunications infrastructure, SiC MOSFETs are becoming central to next-generation designs. However, their lower Short Circuit Withstand Time (SCWT ~2 µs) compared to IGBTs (SCWT ~10 µs) demands ultra-fast protection. Diotec Semiconductor's latest innovation is the solution.

Interview