Electronicsmedia

Kurtz Ersa Inc., a leading supplier of electronics production equipment, announced that Joe Clure, Head of the Applications and Demo Center at the company’s North American headquarters, will present a technical paper titled “Selective Soldering Trends and Techniques for Complex Applications” at the SMTA Long Island Expo & Tech Forum. The event will take...

KIC, a leading provider of thermal process solutions for electronics manufacturing, has announced the expansion of its service capabilities in Mexico. KIC has served customers in Mexico for decades and has maintained a local presence since 2012. KIC Mexico’s main office for sales and support was established in Guadalajara 5 years ago. The company...

ESD Training Webinar: Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, in collaboration with Desco Industries Inc., announced the next series of free, hands-on training webinars designed to help electronics professionals strengthen their understanding of electrostatic discharge (ESD) and workplace compliance standards. The webinar, titled “Hands-On ESD: The...

PR Hoffman is proud to announce its participation in SEMICON Taiwan 2025, taking place September 10–12 at the Taipei Nangang Exhibition Center. This year, PR Hoffman will be exhibiting in collaboration with CohPros International Co., Ltd. at booth 1-2716. The event will bring together leading innovators, manufacturers, and suppliers from across the semiconductor value chain.

Smith, a leading global distributor of electronic components and semiconductors, announces its upcoming exhibition at electronica India from Wednesday, September 17, to Friday, September 19. The event will take place from 9:00 to 18:00 each day at the Bangalore International Exhibition Centre (BIEC) in Bangalore, India. This is the third time Smith has exhibited at electronica India.

As AI, HPC, and 5G drive semiconductor innovation, advanced packaging has become the next strategic focus. Yole Group projects the market to exceed USD 50 billion by 2025, with fan-out panel-level packaging (FOPLP) growing more than 15% annually. E&R Engineering (TPE: 8027) will present its latest laser and plasma solutions at SEMICON Taiwan 2025, covering FOPLP, Through-Silicon...

HighTec EDV-Systeme, Elektrobit and Infineon are partnering to accelerate software innovation in the automotive industry by enabling the integration of Rust applications with AUTOSAR Classic basic software.  As ecosystem partners to Infineon Technologies’ Drive Core for AURIX microcontrollers, HighTec and Elektrobit are delivering a comprehensive development bundle. This joint offering includes Elektrobit’s EB tresos...

Rohde & Schwarz will showcase its solutions and capabilities supporting multi-domain operations by ensuring true spectrum dominance in all domains and along the complete signal chain at MSPO 2025. Rohde & Schwarz, a leading provider of cutting-edge communications and security solutions, is proud to announce its participation at the 33rd International Defence Industry Exhibition MSPO, September 2 to...

At The Things Conference 2025 in Amsterdam, The Netherlands from 23rd to 24th September 2025, Thomas Steen Halkier, CEO of NeoCortec, will be giving a keynote speech on Tuesday 23rd September at 15.55h at the Things Forum One. Halkier will be talking about “NeoMesh on LoRa: Bringing True Mesh Networking to the LoRa PHY”. The keynote explores how NeoMesh on LoRa...

The future of connectivity is often thought of as a terrestrial pursuit, but it's increasingly taking shape in orbit. As India prepares for a new wave of digital transformation, satellite-powered broadband is stepping out from the shadows of speculation and into the light of operational reality. In one of its biggest connectivity milestones to date, DE-CIX India...