Electronicsmedia

Micro-LED Connectivity Solutions: Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, and Mojo Vision, the high-performance micro-LED platform company, announced a long-term collaboration to develop a new class of optical interconnect solutions to power the next wave of high-performance AI data center infrastructure. Today’s rapidly growing AI workloads are beginning...

R2 Wireless, a security technology company developing passive RF spectrum awareness solutions, has raised more than $5 million in new funding, bringing its total capital raised to over $13 million. The funding will support the company’s expansion in the United States, including additional engineering hires and new defense and commercial partnerships following deployments in Europe and the...

TestCenter D2 1.6T Appliance: VIAVI Solutions Inc. has announced the launch of its next-generation TestCenter D2 1.6T Appliance designed to help cloud providers, hyperscalers, neoclouds and network equipment manufacturers accelerate the rollout of 1.6T Ethernet networks. The D2 appliance is the latest addition to VIAVI's comprehensive portfolio of advanced L0-7 PHY validation, AI fabric and...

NEC Corporation has developed a first-of-its-kind physical AI that proactively controls robots to help reduce human stress. This technology utilizes a proprietary "world model" from NEC to predict human movement and psychological states, quantitatively estimating a person's level of stress. The technology was developed based on a world model, an AI system that is attracting...

Spectrum Instrumentation has introduced a new Direct Digital Synthesis (DDS) option for its 65xx series Arbitrary Waveform Generators (AWGs), providing a highly economical solution for generating sinusoidal signals, finely tuneable reference sources, combined sine waves, waveform trains, frequency sweeps, and modulated signals. The release completes the rollout of DDS functionality across Spectrum’s entire AWG portfolio, which now...

UAV Navigation-Grupo Oesía participates in the innovative TICHE Project. The project aims to develop advanced hidden threats detection capabilities in complex environments through a collaborative, multiplatform approach. By merging cutting-edge sensors, AI technology, and unmanned ground and aerial systems, this initiative focuses on expanding detection capabilities while prioritizing factors such as human safety, power efficiency, portability, and...

OpenLight, a leader in heterogeneous III‑V silicon photonic integration and custom Photonic Application‑Specific Integrated Circuits (PASICs), will showcase multiple technology breakthroughs at the Optical Fiber Communication Conference and Exhibition (OFC) 2026, taking place March 15–19 at the Los Angeles Convention Center. At booth #2449, OpenLight will demonstrate its latest advances in high‑speed photonic integrated circuits (PICs) with...

Big things really do come in small packages. At the Embedded World exhibition, Grinn announced the launch of the Grinn GenioSOM-360. This new addition to the Grinn Genio product family is the world’s smallest System-on-Module (SOM) powered by the newly released MediaTek Genio 360P processor. Earlier this month, MediaTek announced the Genio 360P processor,...

Fortinet Report: A recent technical report revealed a significant escalation in cyber risks facing financial institutions across the Middle East and Africa, driven by the accelerating pace of digital transformation and the expanding reliance on cloud infrastructure and advanced technologies. The report indicated a global increase of 1300% in fraud...

Munich Space Summit 2026: Rohde & Schwarz will join industry leaders at the Munich Space Summit, taking place from March 23rd – 27th, 2026. The Summit brings together the Munich Satellite Navigation Summit and the Munich New Space Summit, creating a platform for discussion and collaboration within the space sector.