Electronicsmedia

Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the new E3AS-HF Time of Flight (ToF) laser sensors from Omron Industrial Automation. The E3AS-HF ToF photoelectric sensors achieve stable, continuous-level detection of difficult-to-sense targets for industrial automation, manufacturing and harsh environment applications. The Omron Industrial Automation E3AS-HF ToF laser sensors, available from Mouser, are equipped...

BPC Instruments hereby publishes the half-year report for the period January 1 – June 30, 2025. CEO Dr. Jing Liu comments: “The second quarter confirms the strength and relevance of our business. With 20 percent revenue growth in Q2 year-on-year and sustained profitability, we continue to expand with good margins from a platform and...

Fujitsu announced the development of a secure and efficient AI agent platform to accelerate operational efficiency and ensure stable medical service provision in Japan's healthcare sector. The new platform includes an orchestrator AI agent, a centralized system that supports the collaboration and coordination of multiple specialized healthcare-specific agents developed by Fujitsu and other partner companies. The initiative...

Vehicles across the continent are increasingly shifting from ‘passive’ to ‘active’ safety features with the aim of preventing crashes from happening at all – particularly since an EU mandate came into effect. One part of the shift towards active safety is the evolution of in-cabin driver and occupant monitoring systems. These systems combine critical data within one central intelligence network to create a better...

In 2024, the Moldova Innovation Technology Park (MITP) not only solidified its position as the country's leading tech hub — it also emerged as one of the key drivers of Moldova's economic growth. According to the latest annual report, MITP closed the year with impressive results and an ambitious forecast for 2025: the total revenue generated by park residents...

Cambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company that develops energy-efficient GaN-based power devices that make sustainable electronics simpler to design and implement, today announced the appointment of Robin Lyle as Vice President of R&D.Lyle’s appointment will further strengthen CGD’s mission to revolutionise power electronics and accelerate the transition to energy-efficient systems. A 30-year veteran of...

DigiKey, the leading global electronic components and automation products distributor, announces its annual Back to School Giveaway, which offers university students a chance to win products and swag, including one grand prize of a Teledyne LeCroy Power Supply unit. Five entrants will be randomly selected to win a prize package that includes products such...

PARMI USA, INC., a leader in advanced 3D inspection systems, is pleased to announce the appointment of Prosperar Solutions, led by Henrique Dantas, Commercial Director, as its new representative in Brazil. Based in Campinas, São Paulo, Prosperar Solutions is recognized as a key partner to the electronics industry, providing solutions for PCB assembly, semiconductor...

Naprotek, LLC, a leading provider of mission-critical electronics technology solutions, today announced the appointment of Mark Crebs to Products and Platform Director of Business Development. Mark brings over 25 years of experience in sales and business development, including roles in National and Regional Sales management and in roles with major electronic components distributors across North America.

Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation on addressing thermal challenges in AI and high-performance computing (HPC) with metal-based thermal interface materials (TIMs) at the International Electronics Manufacturing Initiative (INEMI) Forum on Complex Integrated Electronics, to be held September 17-18 in Penang, Malaysia. The presentation, Enabling AI with Metal TIM: Addressing Thermal Challenges Across TIM1, 1.5, and...