Electronicsmedia

Munich Space Summit 2026: Rohde & Schwarz will join industry leaders at the Munich Space Summit, taking place from March 23rd – 27th, 2026. The Summit brings together the Munich Satellite Navigation Summit and the Munich New Space Summit, creating a platform for discussion and collaboration within the space sector.

Milestone Systems and IQSIGHT, previously Bosch Video Systems, strengthen their collaboration with the release of SmartSuite, a consolidated plugin suite for Milestone XProtect video management software. SmartSuite cuts installation time for system integrators by 70% and adds powerful new camera and analytics capabilities. Elevating security operations Milestone Systems and IQSIGHT, formerly...

KNF announces the introduction of four innovative diaphragm pump features for Flow, Pressure, and Vacuum Control as well as Versatile Dosing. These solutions set a new benchmark for precision, reliability, and adaptability. Four New Intelligent PumpsFor liquid metering applications, KNF has developed the FMS-FC 1.400. This diaphragm pump with integrated Flow Control uses a...

EMC Testing Solutions at EMV 2026: Rohde & Schwarz will participate in EMV 2026, Europe’s premier trade fair and congress dedicated to electromagnetic compatibility, held from March 24-26 in Cologne. At the event, which serves as a crucial platform for industry professionals, the company will show its latest advancements in test & measurement...

Clicker 4 dev board: Over 12,000 projects with Renesas dev boards live now on EmbeddedWiki 555 Renesas MCUs supported in NECTO Studio -152 with full mikroSDK support added in February MIKROE, the embedded solutions company that dramatically cuts development time by providing innovative...

SIMCom’s smart AI modules: AI core, MCU and Wi-Fi/Bluetooth connectivity in one 43 x 44 x 3.2mm module See SIMCom at Embedded World on Booth 3-525, Messe Nürnberg, Nuremburg, Germany, March 10-12 2026 SIMCom, a leading provider of cellular wireless modules and solutions...

Würth Elektronik and embedded systems developer Grinn announce their collaboration at embedded world 2026. The first product of this collaboration, the Grinn GenioBoard - Edge AI SBC single-board computer, will be on display at booth 110 in hall 2. This board for edge AI in the IoT is now available from Würth Elektronik. With this offering, Würth...

SiC Power Modules: ROHM has begun online sales of new SiC molded modules: TRCDRIVE pack, HSDIP20 and DOT-247. Amid growing concerns over tightening global power supply and the increasing importance of energy conservation, these products promote the adoption of high-efficiency power conversion using SiC in a wider range of applications.

Embedded World 2026 Award for heliaAOT: Ambiq Micro, Inc., a technology leader in ultra-low power semiconductor solutions for edge AI, announced it has won the 2026 Embedded World Award in the Best Tools category for heliaAOT, its ahead-of-time AI compiler purpose-built for Ambiq’s ultra-low power SoCs. heliaAOT was also nominated in the Best AI category. This marks the third consecutive year Ambiq has received a prestigious...

CEA-Leti and NcodiN, a French deep-tech startup pioneering nanolaser-enabled photonic interconnects, announced a strategic collaboration to industrialize NcodiN's optical interposer technology on a 300 mm integrated photonics process. NcodiN, which received €16 million in seed financing last November, is developing optical interconnects designed to relieve a critical data-movement bottleneck limiting performance in next-generation semiconductors....