Electronicsmedia

PIC100 technology in 300 mm high-volume production for leading hyperscalers, with plans to quadruple capacity by 2027 and further expand in 2028 ST unveils PIC100 through-silicon via (TSV) upcoming technology roadmap STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, is...

ACREX India 2026: Launched Smart 1-Way Cassette AC with nanoe X and Occupancy-Based Energy Optimisation; showcased 2026 Smart Residential AC Portfolio Expanded MirAIe-Enabled smart connectivity for VRF system and Inverter-Driven iCOOL Cold Chain Range with Multi-Refrigerant Flexibility Panasonic Life Solutions India, reinforced its...

AI Accelerator Chips Market: The global AI accelerator chips market was valued at USD 120.2 billion in 2025 and is estimated to grow at a CAGR of 23.6% to reach USD 1 trillion by 2035, according to recent report by Global Market Insights Inc. Market expansion is fueled by escalating...

Highlights: Almost two-thirds of industrial sector leaders see electrification as the most effective lever to achieve net zero targets (65 percent) Most plan to use demand-side flexibility mechanisms to optimize energy use (59 percent) 63 percent view digitalization as a critical enabler of the energy transition

Netskope, a leader in modern security and networking for the cloud and AI era, announced Netskope One AI Security, a suite of AI security capabilities that protect, make visible, and accelerate the entire AI ecosystem, unified within the Netskope One platform. Netskope One AI Security introduces new products to power and enable the AI era, alongside a brand...

Highlights: 2025 market share at 23.2% (2024: 21.4%) in slightly declining overall market Integration of Automotive Ethernet further strengthens microcontroller business for software-defined vehicles and opens growth opportunities in humanoid robots Infineon future-proofs microcontroller portfolio for upcoming cybersecurity requirements such as post-quantum cryptography

Electronics Digital Twin Platform: Key Highlights Open platform to create, deploy, manage, and use electronics digital twins, establishing a new integrated and collaborative engineering paradigm across electronics, software, and systems Pre‑integrated Synopsys and ecosystem partner solutions, combined with management and administration capabilities, provide teams ready-to-use,...

FineX Transparent Conductive Film: Panasonic Industry announces the release of FineX ("FineCross"), a next‑generation transparent conductive film engineered for high‑performance electromagnetic wave shielding in advanced or sensitive display, industrial, and wireless communication environments. FineX combines exceptionally high optical transmissivity, ultra‑low electrical resistance, and outstanding design flexibility—setting a new benchmark for transparent EMI shielding materials.

Octopart, an Altium company, introduced Octopart Discover, the next evolution of Octopart that brings design intent and persistent system context into solutions discovery — moving engineers beyond part search to discovering and evaluating system-fit solutions. Octopart Discover will be showcased at Booth 3A-415 during embedded world. Built as an open platform, Octopart Discover brings...

With the Proteus-IV and Ophelia-IV components, Würth Elektronik presents two new high-performance RF modules based on the latest Nordic nRF54L15-SoC semiconductor. The two modules differ only in terms of their firmware: Proteus-IV is a ready-to-use Bluetooth low-energy 6.0 module with preinstalled firmware, while Ophelia-IV is a flexible developer platform without a specific preinstalled firmware. Individual firmware options for a variety of...