QSMP-15W module adds wireless connectivity to cost-optimised STM32MP1 MPU platform for IoT & Industry 4.0 applications
QSMP-15W module:
Direct Insight, the UK-based technical systems integrator focused on system-on-module solutions, can now deliver and support development for cost-optimised embedded systems applications that require integrated wireless connectivity with the QSMP-15W solder-down QFN-style SoM (system-on-module), featuring an industrial-grade STM32MP1 MPU and a Murata Wi-Fi + Bluetooth module.
“Adding wireless...
TI accelerates the next generation of physical AI with NVIDIA
News highlights:
TI and NVIDIA are collaborating to accelerate the path from simulation to the safe deployment of humanoid robots in the real world.
As part of this collaboration, TI integrated its mmWave radar technology with NVIDIA Jetson Thor and NVIDIA Holoscan to enable low-latency 3D perception and safety...
International Women’s Day 2026: Women Engineers Shaping the Future of Technology
As India's technology and semiconductor ecosystem continues to expand, the conversation around women in STEM is evolving. The focus is shifting from representation alone to participation in building the technologies that power modern industries from advanced sensing and automation to next-generation computing.
India produces a vast pool of engineering talent every year, yet sustaining...
OpenLight Receives First Volume Production Orders for NewPhotonics 800G and 1.6T Laser-Integrated PICs with Tower Semiconductor PH18DA InP-on-Silicon Platform
OpenLight, a leader in heterogeneous III-V-on-silicon photonic integration and custom Photonic Application-Specific Integrated Circuits (PASICs), announced the first-ever volume production orders by a customer on its PH18DA indium phosphide (InP) on silicon photonic platform, developed in collaboration with Tower Semiconductor. This milestone based on NewPhotonics 800G and 1.6T laser-integrated PIC solution marks a major step forward bringing...
Everspin Advances High-Reliability xSPI MRAM Portfolio With 256Mb Density and Production Qualification Milestones
High-Reliability xSPI MRAM:
Everspin Technologies, Inc. (NASDAQ: MRAM), the world's leading developer and manufacturer of magnetoresistive random access memory (MRAM) persistent memory solutions, announced continued progress across its high-reliability (HR) PERSYST xSPI STT-MRAM portfolio, including the completion of full production qualification for its 64Mb MRAM and the expansion of the family to a new 256Mb...
AVer To Showcase Medical Grade PTZ Cameras at HIMSS 2026
AVer's Medical Grade PTZ Cameras at HIMSS 2026:
AVer Information Inc., an award-winning provider of AI audio-video solutions, will exhibit at HIMSS 2026, March 9–12, 2026, at the Venetian Expo & Convention Center in Las Vegas, Nevada. In booth #4016, stand #12 at the Taiwan Medtech Pavilion, AVer will showcase its medical grade...
Ambiq Reveals 12nm SPOT Platform Enabling Operation Down to 300mV for Atomiq
Ambiq Micro, Inc. (“Ambiq”), a leader in ultra-low-power semiconductor solutions for edge AI, revealed new technical details of its upcoming Atomiq SoC. Built on Ambiq’s newly designed 12nm SPOT platform using the TSMC N12e process, Atomiq introduces a new Ultra-Low-Power (ULP) mode engineered to operate as low as 300mV— the lowest operating voltage in Ambiq’s history.
This announcement marks the first planned deployment of SPOT on a FinFET node and reflects continued progress toward initial Atomiq110 samples, with...
Smart City Security Market 2025–2032: USD 78.4 Billion Valuation, 14.6% CAGR, and AI-Driven Surveillance Expansion
The Smart City Security market is witnessing accelerated growth in 2025, driven by urban digitization, AI-powered surveillance, and rising public safety investments. According to Marketintelo, the global Smart City Security market reached USD 78.4 billion in 2025, up from USD 68.3 billion in 2024, reflecting a 14.8% year-over-year (YoY) growth.
Between 2018 and 2023,...
Huawei Exceeds ITU Partner2Connect Pledge Target, Bringing Connectivity to 170 Million People Globally
The announcement was made by Yang Chaobin, CEO of Huawei ICT BG, at the company's TECH Cares Forum in Barcelona. He noted that this achievement exceeds the commitment Huawei made when joining the ITU P2C Digital Coalition in 2022: to connect 120 million people in remote areas by 2025. Yang extended his gratitude to Huawei's telecom customers...
PCIM Asia Shenzhen Conference 2026 focusing on power electronics for AI, data centres, and sustainable energy ecosystems
PCIM Asia Shenzhen Conference 2026:
The PCIM Asia Shenzhen Conference 2026 serves as a key gathering for researchers and engineers from across the global power electronics community. The 2026 conference will focus on the growing domain of power electronics applications in artificial intelligence (AI) and data centres, with these topics becoming increasingly important...
















