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The Rise of Smart Devices: How Connectivity Is Reshaping Everyday Tech

Smart Devices
In recent years, the line between traditional electronics and connected technology has blurred. From smart speakers and wearable health trackers to intelligent home systems, consumers surround themselves with devices that not only perform tasks but also communicate with one another. This wave of connectivity has ushered in a new era of convenience, personalization, and innovation.

Secutech Vietnam 2025 concludes, advancing safety and smart infrastructure through vital industry collaboration

Secutech Vietnam 2025
Secutech Vietnam 2025 came to a close on 16 August at the Saigon Exhibition and Convention Center (SECC), after bringing together key stakeholders and buyers from across Vietnam’s security and fire safety sectors. With a strong focus on promoting smart city advancements, the 18th edition spanned 13,000 sqm and featured 480 exhibiting brands from 17 countries and regions,...

How Sensors and Smart Materials Are Revolutionizing Vehicle Upgrades

Vehicle Upgrades
Open the hood on a modern build and you’ll see fewer purely mechanical “set-and-forget” parts and more components that sense, decide, and adapt. The hot trend isn’t just more power or louder pipes; it’s hardware that listens to the car and the road in real time, then changes its behavior on the fly. That shift is being...

Boeing-Built X-37B Spaceplane Launches, Beginning Eighth Mission

X-37B Launching SpaceX Falcon 9
Highlights: The returnable orbital test vehicle launched aboard a SpaceX Falcon 9 from Cape Canaveral Space Force Station Less than six months since it completed its seventh mission, the X-37B is back in space hosting technology demonstrations for several U.S. government partners including the Defense Innovation Unit and Air...

TI semiconductors enable advanced Earth-observation capabilities of ISRO’s first-of-its-kind NISAR mission

NISAR satellite
News highlights: A deeply-coupled partnership between TI and SAC-ISRO helped enable the mission payloads for the NISAR satellite, which is currently orbiting Earth. TI’s space-grade power management, mixed signal and analog technologies optimize system performance and allow the satellite to operate in the harsh environment of space over the...

C0G MLCCs Offer Space-Saving Option Over Film Capacitors

C0G MLCCs
Film capacitors are renowned for stability, low-loss characteristics, and negligible piezoelectric effects, especially in high-frequency and high-precision analog applications. However, high-voltage multilayer ceramic capacitors (MLCCs) can now match or exceed film capacitors in key areas, such as temperature stability, frequency response, and voltage handling. With their much smaller surface-mount packages, MLCCs are an increasingly obvious choice for...

How FPGAs Enable Efficient Edge AI

FPGAs Enable Efficient Edge AI
Cost-optimized FPGAs Accelerate AI with Configurable Logic In many applications, artificial intelligence (AI) processing at the edge offers the dual benefits of low latency for real-time tasks, such as industrial inspection, and enhanced security where data may be sensitive, such as in medical imaging. Central processing units (CPUs) and graphics processing units (GPUs)...

Arrive AI Revolutionizing Package Delivery with AI and Smart Sensors

AI in Package Delivery
Arrive AI, an autonomous delivery network anchored by patented Arrive Points, is advancing how its devices harness time-of-flight (TOF) sensors to capture real-time data, cut costs and optimize delivery capacity. By incorporating TOF sensors, Arrive AI aims to tackle one of the biggest bottlenecks in the delivery industry: inefficient pickups. Currently, couriers - human...

Industry-standard switching and sensor simulation systems from Pickering Interfaces on show at Productronica India

switching and sensor simulation systems
Pickering Interfaces will showcase its range of industry-standard modular signal switching and simulation products for electronic test and verification, including fault insertion and sensor simulation modules for Hardware-in-the-Loop (HIL) simulation, on stand H3.B47 at Productronica India, which will take place from September 17-19, 2025 at Bangalore International Exhibition Centre, Bengaluru, India. Productronica India is part of the Productronica...

29×40mm Ultra-Small SoM: 2-Second Quick Assembly & Rockchip RK3506J Processor

FET3506J-C SoM
In the field of embedded development, engineers are always pursuing a balance among performance, size, and reliability. FET3506J-C SoM, newly launched by Forlinx Embedded based on Rockchip RK3506J processor, has become the preferred solution for developers in fields such as industrial automation, new energy, consumer electronics, and smart medical care, thanks to its ultra-small size of 29mm×40mm, the...

Interview