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Vishay RGB LED in 0404 Package Provides Independent Control of Red, True Green, and Blue Chips for Wide Color Range

RGB LED
VLMRGB1500… RGB LED: Vishay Intertechnology, Inc. introduced a new tricolor LED that provides luminous intensity to 252 mcd at 5 mA for RGB displays and backlighting. Featuring common anode and separate cathode connections for the red, true green, and blue LED chips inside its compact 1.0 mm by 1.0 mm by 0.65 mm...

Renesas Expands Auto MCU Portfolio with 28nm RH850/U2C for Vehicle Control and Automotive Safety Applications

RH850/U2C Automotive MCU
28nm RH850/U2C Automotive MCU: Latest RH850 family addition building on 4 billion+ units shipped since 2013 Rich connectivity and advanced security for next‑gen E/E architectures Supports latest automotive standards with easy ECU migration and upgrades Lower active and standby power, reducing ECU power demand Renesas Electronics...

The Future is Synchronized: Why Precision Timing Matters More Than Ever

Precision timing
Precise timing has always been a foundational aspect of electronics and system design. What’s changed is when engineers address it. Timing is no longer an afterthought—selected late in the design cycle, after core decisions are made. While engineers may not focus on their specific timing components early in the design cycle, timing itself shapes system architecture from...

Gain Exceptional Performance with High-Frequency End-Launch SMA Bulkhead Option

SMA Bulkhead Connector
Amphenol RF is pleased to introduce a new rear-mount bulkhead SMA jack into our SMA connector portfolio, designed to enable secure panel mounting. This connector offers low VSWR performance which ensures reliable impedance matching and signal integrity. The end-launch PCB interface has a 10 millimeter center pin which supports controlled impedance transitions at the board edge. This...

Indium Corporation to Showcase High-Reliability Solder Technology at APEX EXPO 2026

Indium Corporation
Indium Corporation, a leading materials provider for the electronics assembly market, will feature its high-reliability solder solutions at APEX EXPO 2026, March 17-19, in Anaheim, California. Indium Corporation's showcased products include: Durafuse LT is an award-winning solder paste alloy system with versatile characteristics that provide energy savings and high reliability...

Variscite SoMs Cut EV Charging Station Development Time by 50%, Helping EVSE Suppliers Scale Faster

Variscite
A U.S.-based electric vehicle charging station manufacturer cut its development timeline by approximately 50% after adopting a System on Module (SoM)-based platform from Variscite, a leading global SoM designer, developer and manufacturer. The result illustrates how Variscite's SoM solutions - combining pin compatibility, information security ISO 27001 certification, extended longevity guarantees, and extensive customizability - are helping...

Sense and Decide: How cars are transforming from a ‘smartphone on wheels’ to a real-time sensing platform 

Real-Time Sensing
Real-Time Sensing in Cars: Ask someone to draw a car and the shape will probably be quite similar: a windscreen, four wheels, and doors.  While the external appearance of a car may remain largely unchanged, internal technologies have evolved significantly, transforming the characteristics and capabilities of modern vehicles. Where we once spoke about horsepower, speed, and fuel consumption, today we are more...

AAEON Launches Intelli TWL01 Edge, an Industrial Multimedia PC with Dual 4K Display Support

Intelli TWL01 Edge
AAEON's UP brand has announced the release of the Intelli TWL01 Edge, an Industrial Multimedia PC with dual 4K displays, multiple mounting options, and a range of Intel Core Processor N-series CPUs (formerly Twin Lake). Built to provide a cost-effective platform for multimedia solution building, the Intelli TWL01 Edge hosts two HDMI 2.0b ports...

VIAVI to showcase breakthrough AI Fabric and Optical Test advances at OFC 2026

OFC 2026
VIAVI Solutions will showcase advanced technologies for the validation of next generation AI fabrics at scale at Optical Fiber Communication (OFC) 2026 from March 17-19 at the Los Angeles Convention Center. The evolution of AI, security and high-speed photonics have converged to force a change in validation and optimization strategies. Today, the industry requires...

Grinn Collaborates with Renesas to Launch Grinn ReneSOM-V2H

Grinn ReneSOM-V2H
Bringing a high-performance AI product to market usually takes years of grueling hardware development. Today, Grinn is working together with Renesas to change that narrative. Grinn announced a collaboration centered on the launch of the Grinn ReneSOM-V2H, a production-ready System-on-Module (SOM) that allows engineers to move directly from concept to application. Grinn significantly lowers...

Interview