Electronicsmedia

Non-Magnetic SMPM Connectors: Amphenol RF is pleased to announce the expansion of our non-magnetic connector portfolio with additional SMPM connectors. These connectors are engineered with non-ferrous materials and are available in smooth bore and full detent configurations compatible with existing non-magnetic bullet adapters for a full board-to-board solution. The small footprint of the SMPM interface allows these connectors to be used in a...

NASA has recently announced major changes to its Moon landing program, Artemis. While crewed missions to the lunar surface were planned for 2028, the administration decided to add a preparatory step to test commercial landers in Earth's orbit a year earlier, in 2027. This change is meant to reduce risks and represents a shift toward more incremental mission design...

Anritsu Corporation and MediaTek have successfully verified the AI QoS and AI L4S Technologies featured in MediaTek’s T930 5G CPE platform by using Anritsu’s Radio Communication Test Station MT8000A. By establishing an end to end connection between the client and the game server through the CPE and the MT8000A, the setup recreates a cloud...

Mouser Electronics, Inc., the authorized global distributor with the newest electronic components and industrial automation products, is now shipping the new Agilex 5 FPGAs and SoCs from Altera. The Agilex 5 FPGAs and SoCs serve a broad range of high-performance, low power, smaller form factor, and logic density uses, such as wireless and wireline communications, video and broadcast equipment, industrial, test and measurement, data centers, medical, and defense applications.

NTT DOCOMO, INC. and NEC Corporation announced the launch of Japan’s first commercial 5G core network (5GC) on Amazon Web Services (AWS) on February 26. Advanced architecture, constructed using Agentic AI, enables the network to flexibly and rapidly expand capacity, such as dynamically expanding its capacity in response to sudden traffic surges, for dramatically improved reliability, flexibility and sustainability.

Key Highlights Synopsys helps Innatera design chips that enable real-time, energy-efficient AI processing at the edge, catalyzing the development of next-generation applications in physical AI Synopsys PathFinder-SC signoff solution delivers improved precision for more accurate layout-level outcomes, expertly manages design requirements, and enables early-phase analysis Synopsys...

Rohde & Schwarz and Qualcomm Technologies, Inc. have reached another pivotal milestone in 6G research and ecosystem readiness, successfully demonstrating carrier aggregation across FR1 and FR3 frequency ranges. The joint achievement is showcased live at MWC Barcelona 2026. At MWC Barcelona, Rohde & Schwarz and Qualcomm Technologies present a live demonstration at the Rohde...

Market Summary According to latest research by Growth Market Reports, the global Artificial Intelligence Chipset market size reached USD 29.8 billion in 2024, demonstrating robust expansion driven by the rapid proliferation of AI-powered applications across industries. The market is expected to maintain a strong growth trajectory, registering a CAGR of 32.1% from 2025 to 2033. By 2033, the AI Chipset...

AI-driven RAN control for 6G mobile communications: NTT DOCOMO INC. and VIAVI Solutions Inc. (VIAVI) have successfully completed a joint study demonstrating AI-driven radio access network (RAN) control for next-generation 6G mobile communications. The results will be showcased at VIAVI's Stand 5B18 at Mobile World Congress (MWC) Barcelona 2026, which takes place March 2-5 in Barcelona,...

ROHM Co., Ltd. and Suchi Semicon Pvt. Ltd. are pleased to announce the establishment of a strategic semiconductor manufacturing partnership in India. This collaboration reflects a shared commitment to strengthening semiconductor manufacturing capabilities in India while supporting the requirements of both domestic and global markets. By combining ROHM’s device technology expertise and global semiconductor...