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LiDAR for automotive_yole

LiDAR is becoming a key component for automotive applications

The automotive LiDAR story began with a race. The DARPA Grand Challenge was an autonomous vehicle race to encourage the development of fully autonomous...
DRAM and NAND markets

DRAM and NAND markets have softened dramatically, but the future remains bright: Yole

The combined DRAM and NAND memory markets experienced a period of extraordinary growth over the past several years, driven by important megatrends including mobility,...
RF SiP packaging market

5G revolution will redefine RF front-end SiP

“From a technology viewpoint, base stations to smartphones, protocols to hardware, semiconductor devices and packaging, 5G requires disruptive innovations and not incremental ones as...

Fiber Optic Test Equipment Market to Witness a Stunning 6.7% CAGR through 2019-2027

Sales of fiber optic test equipment exceeded 1.2 million units in 2018, and is estimated to register a 5.6% Y-o-Y growth in 2019, according...
5G Tester Market

5G Tester Market Expected to Reach US$ 629 million in 2019: Future Market Insights

Nearly 75 thousand 5G testers were sold in 2018. According to a recent intelligence report presented by Future Market Insights, the sales volume of...

Broadcom replaced Qualcomm from Top Ten IC Design Companies List

TrendForce's, a Taipei-based market research firm, has released its latest stats on global top ten IC design companies of 2018, ranked by revenue. Among the...
NVM Memory Cell

Cea-Leti and Stanford target Edge-AI Apps with Breakthrough NVM Memory Cell

Researchers at CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing...
5G Deployments Worldwide

The State of 5G Deployments Worldwide: VIAVI Reports

Viavi Solutions Inc. today revealed new industry data demonstrating just how quickly 5G networks are rolling out worldwide, with 55 commercial 5G networks expected...
Stacking Technologies

2.5D & 3D Stacking Technologies for High Performance Computing, Artificial Intelligence & Datacenter

2.5D and 3D stacking technologies are the only solution that meet the required performance of applications like AI and datacenter as for today”, confirms Mario Ibrahim,...
Augmented Reality

Cea-Leti Combines Integrated Optics & Holography in Novel Lens-Free, AR Technology

Leti, an institute of CEA-Tech, has developed a novel retinal-projection concept for augmented reality (AR) uses based on a combination of integrated optics and...

Interview