NeoPhotonics Samples lasers for long-range automotive Lidar
NeoPhotonics is sampling high power Semiconductor Optical Amplifiers (SOAs) and Narrow Linewidth (NLW) Distributed Feedback Lasers (DFB) lasers for long-range automotive Lidar...
Industry’s First 3rd-Gen (16GB) High Bandwidth Memory 2E
Samsung Electronics today launched its third-generation High Bandwidth Memory 2E (HBM2E), ‘Flashbolt’, in the market. The new 16-gigabyte (GB) HBM2E is uniquely...
AI reshapes chip markets & Propel Sales of semiconductors
AI chips are used widely in various markets, including automotive, communication, computers, consumer electronics, industrial and healthcare. The largest single market...
Multi-Year Silicon Carbide Wafer Supply Agreement between ROHM’s SiCrystal & STMicroelectronics
ROHM and STMicroelectronics today announced it signed a multi-year silicon carbide (SiC) wafers supply agreement with SiCrystal, a ROHM group company having...
SCR (Silicon Controlled Rectifier)
What is Silicon Controlled Rectifier:A Silicon Controlled Rectifier is a four layer, three terminal pnpn device with three junctions namely J1, J2, J3 with...
Isolated SiC Gate Driver IC improves Power Supply Efficiency
With the MAX22701E isolated gate driver from Maxim Integrated designers of high-voltage/high-power systems can improve power supply efficiency by up to 4...
Semiconductor Assembly and Test Services Market
Semiconductors have made their presence in almost every industry vertical. The market for semiconductor assembly and test services (SATS) is projected to...
Keysight, Marvin Test Solutions Collaborate to Speed Manufacturing of mmWave Semiconductors
Keysight Technologies' collaboration with Marvin Test Solutions, Inc. (MTS) has resulted in the development of a fast and accurate 5G semiconductor manufacturing test platform. The...
P-N Junction Breakdown & Difference between Zener & Avalanche Breakdown
Breakdown
is a phenomenon which occurs in a P-N junction diode. When a P-N junction is
reverse-biased and the reverse voltage is increased from...
New Automatic Flip-Chip Bonder Dedicated to Device Production
SET, Smart Equipment Technology, the leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced the release of NEO HB, an automatic flip-chip bonder designed...
