Integrated Intelligent Power Module to Solve the Problem of Motor Control
Motor is the core components of most electrical equipment, and also the most power consuming device. If we could effectively control the operation of...
ROHM, foray into the Indian Electric Vehicle market, with the Low Power and Energy...
ROHM, a Japanese semiconductor manufacturer plans to foray into the Indian market with it’s low power and energy efficient power supplies to meet the growing...
Multiprotocol Wireless Software from Silicon Labs Advances IoT Connectivity for Next-Generation Applications
Multiprotocol Wireless Software:
Silicon Labs has released new dynamic multiprotocol software for its Wireless Gecko system-on-chip (SoC) and module...
NXP Software Development Kit with Apple HomeKit for Smart Home Market
NXP Semiconductors announced that its Apple HomeKit Software Development Kit (SDK) offers full support for home automation applications using HomeKit, delivering exceptional performance, advanced...
Bluetooth chips from Nordic Semiconductor
Nordic Semiconductor is a fabless company. It comes from Norway, and it’s seated in Oslo. It specializes in manufacturing chips for communication over the...
Renesas Electronics Expands 3D Graphics Cluster Market to Entry-Class Cars with R-Car D3 System-on-Chip
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced its high-performance R-Car D3 automotive infotainment system system-on-chip (SoC), designed to expand the...
NXP Integrates NFC Technology into LPC800 Series Microcontrollers Revolutionizing Smart Tagging in IoT Applications
NXP Semiconductors N.V., the leader in mass market microcontrollers, announced the new LPC8N04 MCU, the latest addition to the rapidly expanding LPC800 series of...
ON Semiconductor Introduces Preconfigured Development Suite Providing Easier Way to Build Hearing Aids
ON Semiconductor, driving energy efficient innovations, continues to grow its broad portfolio of ultra-low-power solutions for the hearing health industry by unveiling the Ezairo...
NXP Revolutionizes ID Security and Durability with World’s Thinnest Contactless Chip Module
Highlights:
NXP is the first in the market to offer a contactless chip module with a thickness of <200 µm, representing the world’s thinnest...
Cypress Enables Dynamic 3D Graphics in Hybrid Instrument Clusters and Head-Up Displays with New...
Cypress Semiconductor Corp., announced a new series in its Traveo automotive microcontroller (MCU) family with more memory to support a hybrid instrument cluster with...
