Littelfuse Launches CPC2501M Solid-State Relay IC with Integrated Chime Bypass for Video Doorbells
Littelfuse, Inc., an industrial technology manufacturing company empowering a sustainable, connected, and safer world, introduced the CPC2501M, a robust, self-actuating, normally closed...
SFN launches ‘Infrastructure Time Machine’ that enables fabs to reduce semiconductor production times 10...
Search for the Next (SFN), developers of the compound combination of the Bizen wafer process, Zpolar transistor and Zpolar Tunnel Logic (ZTL),...
Renesas Launches RA8E1 & RA8E2 MCUs with Arm Cortex-M85 Processor for Cost-Sensitive Applications
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, introduced the RA8E1 and RA8E2 microcontroller (MCU) groups, extending the industry's most...
GLOBALFOUNDRIES Surpasses $2 Billion in Design Win Revenue on 22FDX® Technology
GLOBALFOUNDRIES on July 9, announced that the company's 22nm FD-SOI (22FDX®) technology has delivered more than two billion dollars of client design win revenue. With...
STMicroelectronics to build the world’s first fully integrated silicon carbide facility in Italy
New high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in...
Electrons Move Faster in Germanium Tin Than in Silicon or Germanium
Results Reported in Nature Article Suggest Vertical GeSn Transistors May Someday Enable Low-Power, High-Performance Chips and Quantum Computers
CEA-Leti research scientists...
700V & 600V Super Junction MOSFETs in SMD-type Packages
Alpha and Omega Semiconductor announced the release of 700V and 600V αMOS5™ Super Junction MOSFET families in SMD-type DFN5x6 and DFN8x8 packages. αMOS5 is...
Semiconductor Packaging: The Unsung Hero Powering Tomorrow’s Electronics
In the race to make electronics smaller, faster, and more powerful, the spotlight often falls on transistor density and chip architecture. However,...
10nm pattern generation using thermal scanning probe lithography enabled by simplified materials and processes
Thermal scanning probe lithography (tSPL) has been used to create patterns with sub-20 nm half pitch resolution. Pattern generation uses a thermally sensitive resist...
GigaDevice Highlights Breakthroughs Across AI, Power, and Consumer Applications at Embedded World 2025
GigaDevice, a leading semiconductor company specializing in Flash memory, 32-bit microcontrollers (MCUs), sensors, and analog products, will present its latest breakthroughs in AI-driven facial and voice...
