onsemi and Würth Elektronik Advance High-Accuracy Virtual Design of Power Electronic Applications
onsemi and Würth Elektronik announced the integration of Würth Elektronik's passive components database into onsemi's one-of-a-kind Self-Service PLECS® Model Generator (SSPMG). This intuitive...
Cypress Enables Dynamic 3D Graphics in Hybrid Instrument Clusters and Head-Up Displays with New...
Cypress Semiconductor Corp., announced a new series in its Traveo automotive microcontroller (MCU) family with more memory to support a hybrid instrument cluster with...
onsemi Silicon Carbide Technology supports BMW Group’s Next-Generation Electric Vehicles
onsemi announced a long-term supply agreement (LTSA) with BMW AG (BMW) for onsemi's EliteSiC technology in the German premium car manufacturer's electric drivetrains...
CDAC to pool the Design licenses centrally to be made available to students at...
Ministry of Electronics and Information Technology (MeitY) with its series of graded and proactive steps, is in the process of systematic overhaul...
ASIC (Application-Specific Integrated Circuits): 2025 Comprehensive Guide
Introduction: The Rise and Importance of ASICs
In today's fast-moving technology world, Application-Specific Integrated Circuit (ASIC) is playing an...
Samsung Electronics is the World’s Largest Patent Holder
Samsung Electronics has indeed held a strong position in the world’s top 10 semiconductors companies, but it also secured the World's Largest...
For next-generation compute applications GF added features to its 14/12nm FinFET offering
As part of the company's new focus on intensifying investment in differentiation, GLOBALFOUNDRIES announced at its annual Global Technology Conference (GTC), plans to introduce...
India’s First 3nm Chip Design Centres opens in Noida and Bengaluru
Union Minister for Electronics & Information Technology, Railways, and Information & Broadcasting, Shri Ashwini Vaishnaw, on May 13th, inaugurated two new state-of-the-art...
The first billion in sight: celebrating the success of Infineon’s 28 nm security ICs...
Higher efficiency and lower environmental footprint resulting in more powerful, sustainable applications: products manufactured in the 28 nanometer technology by Infineon Technologies...
New QSMP-25 solder-down module features next-gen STM32 MPU to enable secure edge AI in...
QSMP-25 SoM:
Direct Insight, the UK-based technical systems integrator focused on system-on-module (SoM) solutions, can now deliver and...
