CCPAK1212 package pushes the performance of Nexperia’s power MOSFETs to the next level
Nexperia announced the launch of 16 new 80 V and 100 V power MOSFETs in the innovative copper-clip CCPAK1212 package, delivering industry-leading ...
ROHM’s EcoSiC Technology has been Adopted in COSEL’s HFA/HCA Series of 3.5kW Output AC-DC...
ROHM has announced the adoption of its EcoSiC products, including SiC MOSFETs and SiC Schottky barrier diodes (SBDs) in the HFA/HCA series...
Why SiC MOSFETs are Your Choice for Hyperscale Data Centers
Today’s data centers need power semiconductors that efficiently convert electric power to reduce costs and lower emissions. More efficient power conversion equals...
Nexperia launches miniaturized leadless logic ICs to save space and enhance reliability in automotive...
Nexperia introduced a new portfolio of logic ICs in tiny automotive-qualified MicroPak XSON5 leadless packaging. Miniaturized logic ICs are essential for space...
Ampere and STMicroelectronics collaborate on powerbox with long term supply for silicon carbide
Highlights:
Multi-year agreement between STMicroelectronics and Renault Group secures Ampere's supply of Silicon Carbide power modules
Vishay 40 V MOSFET in PowerPAK 10×12 Package Offers Best in Class RDS(ON) of 0.34...
To provide higher efficiency and power density for industrial applications, Vishay Intertechnology, Inc. introduced a new 40 V TrenchFET Gen V n-channel...
Experts: EU Must Pair €43B Semiconductor Funding with Talent Development and National Measures to...
A European Commission strategy titled "The Future of European Competitiveness" highlights the urgent need for Europe to address its growing innovation gap...
The first billion in sight: celebrating the success of Infineon’s 28 nm security ICs...
Higher efficiency and lower environmental footprint resulting in more powerful, sustainable applications: products manufactured in the 28 nanometer technology by Infineon Technologies...
ULVAC Launches New Deposition System for Semiconductor Applications: Model “ENTRON-EXX”
ULVAC, Inc. (HQ: Chigasaki, Kanagawa) has started accepting orders for the ENTRON-EXX, a new multi-chamber deposition system for semiconductor applications. The ENTRON-EXX...
Renesas Launches High-Performance RZ/T2H MPU for Industrial Ethernet and Multi-Axis Motor Control
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, launched the RZ/T2H, the highest performance microprocessor (MPU) offered by Renesas for...
