NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
Highlights:
S32R47 family are NXP’s highest performing radar processors, addressing the demanding requirements of Level 2+...
MediaTek new SoCs Bring Wi-Fi 6 & Bluetooth 5.2 Connectivity to IoT Devices
MediaTek announced the new MediaTek Filogic 130 and Filogic 130A system-on-chips (SoCs) which both integrate a microprocessor (MCU), AI engine, Wi-Fi 6 and...
New members in CoolSiC MOSFET Power Modules Family
Addressing the fast growing demand for Silicon Carbide (SiC) solutions, Infineon Technologies AG launches new devices in the 1200V CoolSiC MOSFET family.The CoolSiC Easy...
TI advances power density and efficiency at PCIM 2025
PCIM 2025
Texas Instruments (TI) is demonstrating new power-management products and designs at the Power Conversion, Intelligent Motion (PCIM)...
ROHM Develops Ultra-Low-Power On-Device Learning Edge AI Chip
AI at the edge enables real-time failure prediction without cloud server required
ROHM has developed an on-device learning AI...
XENSIV magnetic 3D sensor enables high-precision position detection in automotive, industrial, and consumer applications
XENSIV 3D Magnetic Sensors:
Leveraging its expertise in magnetic position sensors, Infineon Technologies AG has launched the third...
High Accuracy Current Sense Amplifier ICs for Industrial Applications
ROHM’s New ±1% Accuracy Current Sense Amplifier ICs Reduce Mounting Area by Approx. 46% Over Conventional Configurations
ROHM has...
STMicroelectronics Announces Status of Common Share Repurchase Program
STMicroelectronics N.V. (the “Company” or “STMicroelectronics”), a global semiconductor leader serving customers across the spectrum of electronics applications, announces full details of...
STMicroelectronics and MACOM RF Gallium-Nitride-on-Silicon prototypes achieve technology and performance milestones
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and MACOM Technology Solutions Holdings Inc. (“MACOM”) , a leading supplier...
Infineon unveils the world’s thinnest silicon power wafer, pushing technical boundaries and improving energy...
Highlights:
Infineon first to master handling and processing of ultra-thin 20-micrometer power semiconductor wafers
