Renesas Electronics Expands 3D Graphics Cluster Market to Entry-Class Cars with R-Car D3 System-on-Chip
Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced its high-performance R-Car D3 automotive infotainment system system-on-chip (SoC), designed to expand the...
NXP Integrates NFC Technology into LPC800 Series Microcontrollers Revolutionizing Smart Tagging in IoT Applications
NXP Semiconductors N.V., the leader in mass market microcontrollers, announced the new LPC8N04 MCU, the latest addition to the rapidly expanding LPC800 series of...
ON Semiconductor Introduces Preconfigured Development Suite Providing Easier Way to Build Hearing Aids
ON Semiconductor, driving energy efficient innovations, continues to grow its broad portfolio of ultra-low-power solutions for the hearing health industry by unveiling the Ezairo...
NXP Revolutionizes ID Security and Durability with World’s Thinnest Contactless Chip Module
Highlights:
NXP is the first in the market to offer a contactless chip module with a thickness of <200 µm, representing the world’s thinnest...
Cypress Enables Dynamic 3D Graphics in Hybrid Instrument Clusters and Head-Up Displays with New...
Cypress Semiconductor Corp., announced a new series in its Traveo automotive microcontroller (MCU) family with more memory to support a hybrid instrument cluster with...
Samsung’s New Image Sensors Bring Fast and Slim Attributes to Mobile Applications
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, introduced two new ISOCELL image sensors: 1.28-micrometer (μm) 12-megapixel (Mp) ISOCELL Fast 2L9 with...
STMicroelectronics Combines Unique Development Ecosystem with Alibaba AliOS for First Chinese Cloud-to-Node IoT Platform
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced its cooperation with Alibaba Cloud, the cloud computing arm and business...
Global Electronics Components Market Sees Continued Growth (7.7% CAGR)
The increasing visibility of electronics devices, the growing need for smaller, thinner components able to cope with extreme conditions and the rising demand for...
Teledyne HiRel Electronics Adopts Adesto Technologies Resistive RAM Technology (CBRAM) for Aerospace and Defense...
Adesto Technologies, a leading provider of application-specific, ultra-low power non-volatile memory products, announced that Teledyne HiRel Electronics has adopted its resistive RAM (CBRAM) resistive...
First Littelfuse SiC MOSFET Provides Ultra-Fast Switching in Power Electronics
Littelfuse, Inc., the global leader in circuit protection, introduced its first series of silicon carbide (SiC) MOSFETs, the latest addition to the company’s growing...
