New 24V MOSFET for Wireless Earphone Batteries
Magnachip Semiconductor Corporation announced today that the company has unveiled a new 24V Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) for wireless earphone batteries.
STMicroelectronics is Aggressive in its $20B+ Revenues Ambition and Carbon-Neutral Goal
STMicroelectronics, the global semiconductor leader, is known for its innovative, energy-efficient products, solutions and sustainable business model is all set to achieve...
Silicon Carbide cooperation between SEMIKRON and ROHM Semiconductor
SEMIKRON, headquartered in Nuremberg, and the Kyoto-based company ROHM Semiconductor have been collaborating for more than ten years with regards to the...
Are Micron and Taiwanese Semi Suppliers Showing Early Warning Signs for Industry
On June 30, 2022, Micron, the third largest memory supplier in the world, reported its fiscal 3Q results that ended in May....
STMicroelectronics & GlobalFoundries to advance FD-SOI Ecosystem in a New Fab at France
STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications, and GlobalFoundries Inc. (Nasdaq: GFS), a global leader in...
Powerful Step Towards Industrialization Of Linear Si Quantum Dot Arrays Using FDSOI Material
Silicon spin qubits represent one of the most promising avenues to achieving practical quantum computing, and new research into room-temperature parametric test...
Renesas Develops Circuit Technologies for STT-MRAM
Renesas Electronics Corporation has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM, hereinafter MRAM) test chip with fast...
Nordic Thingy:53 brings dual-Arm Cortex-M33 processor power
The latest addition to Nordic’s Thingy range combines the company’s flagship dual-core SoC, Power Management IC, PA/LNA range extender, and multiple sensors,...
STMicroelectronics and MACOM RF Gallium-Nitride-on-Silicon prototypes achieve technology and performance milestones
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, and MACOM Technology Solutions Holdings Inc. (“MACOM”) , a leading supplier...
Die-to-Wafer Self-Assembly Breakthrough Targeting High Alignment Accuracy and Throughput
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimized a hybrid direct-bonding, self-assembly process that has...
